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Assignee: Dow Corning Corporation


Location: Auburn, MI
No. of patents: 7

NumberTitleIssue Date
7915809Electrophosphorescent organic light emitting diode formed using solvent soluble materials
The present invention provides an electrophosphorescent organic light-emitting diode (OLED). The electrophosphorescent OLED includes a substrate having a first opposing surface and a second opposing surface, a first electrode layer overlying the first opposing surfa...
03/29/2011
7902118Compositions and methods for protecting cultivated plants from herbicidal injury
Compositions comprising a herbicide wherein it is desired that the compound not be retained by the plant foliage, and a repellant adjuvant, wherein the repellant modifies the surface properties of the composition so that retention of the composition on foliage of a ...
03/08/2011
7368173Siloxane resin-based anti-reflective coating composition having high wet etch rate
Herein we disclose a composition, comprising a siloxane resin having the formula (HSiO3/2)a. (SiO4/2)b(HSiX3/2)c(SiX4/2)d, wherein each X is independently —O—, —OH, or —O...
05/06/2008
7109268Process for making silicone emulsions
In a process for the production of a silicone in water emulsion in which a polysiloxane fluid, at least one surfactant and water are continuously fed to a high shear mixer in such proportions as to form a viscous oil in water emulsion which is continuously withdrawn...
09/19/2006
7101821Silicon composition
This invention provides a silicon composition comprising at least 15 wt % of hydrolysed silicon compounds and at least 3 wt % of a binder material. The silicon composition is used in the manufacture of ceramics. The hydrolysed silicon compounds can for example be th...
09/05/2006
6767819Apparatus with compliant electrical terminals, and methods for forming same
An apparatus is disclosed including an electrical conductor and an electrically conductive, compliant bump formed on the electrical conductor. The compliant bump includes an electrically conductive, solderable capping layer and an electrically conductive, compliant ...
07/27/2004
6737117Hydrosilsesquioxane resin compositions having improved thin film properties
Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting ...
05/18/2004
 
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