Quotables
"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
Lee deForest, American radio pioneer ; 1957
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| Number | Title | Issue Date |
| 8178425 | Optical device wafer processing method An optical device wafer processing method for dividing an optical device wafer into a plurality of individual optical devices. The optical device wafer is composed of a substrate and a semiconductor layer formed on the front side of the substrate. The optical device... | 05/15/2012 |
| 8178423 | Laser beam machining method and laser beam machining apparatus A laser beam machining method wherein machining areas in which to form machined grooves and machining start point areas in which to form shallow grooves shallower than the machined grooves are alternately set in each of streets formed on a wafer, and the machined gr... | 05/15/2012 |
| 8148184 | Optical device wafer processing method An optical device wafer processing method for dividing an optical device wafer into a plurality of individual optical devices. The optical device wafer is composed of a substrate and a semiconductor layer formed on the front side of the substrate. The optical device... | 04/03/2012 |
| 8143552 | Laser beam machining system A laser beam machining system including a chuck table for holding a work, and a laser beam irradiation unit for irradiating the work held on the chuck table with a laser beam, wherein the laser beam irradiation unit includes: a pulsed laser beam oscillator for oscil... | 03/27/2012 |
| 8142259 | Grinding machine and method A grinding machine includes a holding table adapted to hold a workpiece, a grinding unit operative to grind the workpiece held on the holding piece, and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving ... | 03/27/2012 |
| 8129277 | Method of machining wafer A method of machining a wafer in which, at the time of grinding the back-side surface of the wafer, only a back-side surface region corresponding to a device formation region where semiconductor chips are formed is thinned by grinding, to form a recessed part on the... | 03/06/2012 |
| 8124909 | Laser processing apparatus A laser processing apparatus including a height detecting device for detecting the height of a workpiece held on a chuck table. The height detecting device includes an annular spot forming unit for forming the spot shape of a detecting laser beam into an annular spo... | 02/28/2012 |
| 8104665 | Manufacturing method for composite substrate A composite substrate manufacturing method including the steps of grinding a sapphire substrate to uniform the thickness of the sapphire substrate, next forming an optical device layer on the front side of the sapphire substrate, next bonding the front side of a hea... | 01/31/2012 |
| 8101504 | Semiconductor chip fabrication method A semiconductor chip fabrication method including a modified layer forming step of applying a laser beam having a transmission wavelength to the semiconductor wafer from the back side of the semiconductor wafer along the streets formed on the front side of the semic... | 01/24/2012 |
| 8100742 | Grinding method for wafer having crystal orientation A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning ... | 01/24/2012 |
| 8071464 | Manufacturing method for light emitting device A light emitting device manufacturing method including the steps of corrugatedly scanning a laser beam along a plurality of division lines formed on a light emitting device wafer having a sapphire substrate layer and a light emitting layer to apply the laser beam to... | 12/06/2011 |
| 8066550 | Wafer polishing method and apparatus A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y directio... | 11/29/2011 |
| 8049134 | Laser processing machine A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first lase... | 11/01/2011 |
| 8049133 | Laser beam machining apparatus A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a... | 11/01/2011 |
| 8048780 | Method of processing optical device wafer A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the f... | 11/01/2011 |
| 8040520 | Device for detecting the edges of a workpiece, and a laser beam processing machine A device for detecting the edges of a workpiece held on the chuck table of a processing machine, having a beam oscillation means for oscillating a detection beam, an objective lens for focusing the detection beam oscillated from the beam oscillation means, and a ref... | 10/18/2011 |
| 8029335 | Wafer processing method In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary ... | 10/04/2011 |
| 8026153 | Wafer processing method A wafer processing method of dividing a wafer into individual devices, the wafer having on a front surface a device area and an external circumferential redundant area surrounding the device area, the method including: a wafer grinding step in which, in the state wh... | 09/27/2011 |
| 8025556 | Method of grinding wafer A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck tabl... | 09/27/2011 |
| 8025553 | Back grinding method for wafer A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin ... | 09/27/2011 |
| 8025069 | Semiconductor wafer treating apparatus A semiconductor wafer treating apparatus comprising a housing, holding means rotatably disposed within the housing, rotating means for rotating the holding means, and cleaning means for cleaning a semiconductor wafer held on the holding means. Irradiation means for ... | 09/27/2011 |
| 8021963 | Wafer treating method A wafer treating method includes the steps of irradiating a wafer, provided with devices on the face side, from the back side with a laser beam capable of being transmitted through the wafer, while converging the laser beam to a predetermined depth, so as to form a ... | 09/20/2011 |
| 8017003 | Processing waste liquid treating apparatus In a processing waste liquid treating apparatus, a housing includes a bottom wall, an upper wall, a left lateral wall, a rear wall and an opening/closing door for opening/closing a front opening. A waste liquid tank is disposed on the bottom wall and close to the re... | 09/13/2011 |
| 8016643 | Wafer grinding method A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protectiv... | 09/13/2011 |
| 7998840 | Wafer laser processing method and apparatus A wafer laser processing method for forming deteriorated layers in the inside of a wafer having a device area and a peripheral excess area surrounding the device area, the surface of the device area being higher than the surface of the peripheral excess area, involv... | 08/16/2011 |
| 7994452 | Laser beam machining apparatus A laser beam machining apparatus including a beam oscillator; a beam adjusting unit disposed between the beam oscillator and a condenser lens and by which the beam diameter and the divergence angle of the beam oscillated from the beam oscillator are adjusted; and a ... | 08/09/2011 |
| 7994451 | Laser beam processing machine A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a pulse laser beam to the workpiece held on the chuck table, and a processing-feed means for processing-feeding the chuck table and the lase... | 08/09/2011 |
| 7994025 | Wafer processing method without occurrence of damage to device area A wafer processing method of processing a wafer having on a front surface a device area where a plurality of devices are formed by being sectioned by predetermined dividing lines, and an outer circumferential redundant area surrounding the device area, includes the ... | 08/09/2011 |
| 7982279 | Method of manufacturing stacked-type semiconductor device A method of manufacturing a stacked-type semiconductor device, including the steps of: forming dividing grooves, having a depth corresponding to a finished thickness for a plurality of first chips formed on the face side of a wafer, on the face side of the wafer alo... | 07/19/2011 |
| 7978408 | Polarizing device and laser unit A polarizing device for converting a circularly polarized light beam into a radial polarized light beam, wherein the circularly polarized light beam is obtained by passing a linearly polarized light beam oscillated from a laser oscillator through a quarter-wave plat... | 07/12/2011 |
| 7977215 | Method of processing optical device wafer A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bo... | 07/12/2011 |
| 7968821 | Laser processing beam machine A laser processing beam machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application... | 06/28/2011 |
| 7960250 | Method for manufacturing device A method for manufacturing a device, in which a wafer having a plurality of devices formed on the face thereof is divided into the individual devices, and an adhesive film is mounted on the back side of each device. This method comprises: a cutting groove forming st... | 06/14/2011 |
| 7935910 | Method of laser drilling vias A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads formed on each of the devices by applying a pulse laser beam from the rear surface side of the substrate, wherein when... | 05/03/2011 |
| 7932478 | Laser processing machine A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section ... | 04/26/2011 |
| 7927974 | Method of forming a modified layer in a substrate First, mapping data storing interrupted areas is obtained. In a first modified-layer forming step, before a stacked article is stacked on a front surface of a substrate, a laser beam is directed to the interrupted areas based on the mapping data to form modified lay... | 04/19/2011 |
| 7919725 | Via hole forming method A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads on each of the devices, by applying a laser beam from the rear surface side of the substrate, comprising the steps of ... | 04/05/2011 |
| 7919395 | Method for separating wafer using two laser beams A wafer separating method including a laminated member removing step for partially removing a laminated member of a wafer along streets by applying a laser beam to the wafer along the streets, and a cutting step for cutting a substrate of the wafer along the streets... | 04/05/2011 |
| 7915142 | Wafer processing method A wafer processing method for dividing a wafer into individual devices along streets. The wafer processing method includes the steps of forming a division groove on the front side of the wafer along each street, attaching the front side of the wafer to the front sid... | 03/29/2011 |
| 7915140 | Fabrication method for device having die attach film on the back side thereof A device fabrication method for fabricating individual devices from a wafer, wherein the back side of each device is covered with an adhesive film for die bonding. The device fabrication method includes a wafer dividing step of dividing the wafer into the individual... | 03/29/2011 |
