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A kissing shield comprised of a thin, flexible membrane and a frame or holder.
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| Number | Title | Issue Date |
| 4947598 | Method for grinding the surface of a semiconductor wafer A dresser made of bonded alundum-type abrasive is ground by a rotating blade made of bonded super abrasive to dress the blade. The surface of a semiconductor wafer is ground by the rotating dressed blade to convert it into a matte-finished surface substan... | 08/14/1990 |
| 4872289 | Cutter A cutter for cutting a plate-like material such as a glass sheet along concentric circular inside and outside cutting lines. The cutter includes a movably mounted supporting base stand, at least two material holding chucks disposed on the supporting base ... | 10/10/1989 |
| 4843766 | Cutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereof A cutting tool comprising a supporting base and an outside and an inside abrasive grain layer projecting concentrically from the supporting base in a radially spaced relationship, and a method for its production. The outside and inside abrasive grain laye... | 07/04/1989 |
| 4839996 | Method and apparatus for machining hard, brittle and difficultly-machinable workpieces Machining of a hard, brittle and difficultly-machinable workpiece by a grinding wheel made of superabrasive grains. The grinding wheel is rotated at a peripheral speed of 1000 to 5500 m/min., and the grinding wheel and the workpiece are moved relative to ... | 06/20/1989 |
| 4817341 | Cutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereof A cutting tool comprising a supporting base and an outside and an inside abrasive grain layer projecting concentrically from the supporting base in a radially spaced relationship, and a method for its production. The outside and inside abrasive grain laye... | 04/04/1989 |
| 4757550 | Automatic accurate alignment system An automatic accurate alignment system for positioning an object to be worked which has a certain pattern on its surface at a required position. The system performs primary positioning of the object to be worked on the basis of low magnification pattern m... | 07/12/1988 |
| 4753049 | Method and apparatus for grinding the surface of a semiconductor A method and an apparatus for grinding the surface of a semiconductor wafer by moving a holding table and a grinding wheel relative to each other in a predetermined direction substantially parallel to the surface of the semiconductor wafer held onto the h... | 06/28/1988 |
| 4720635 | Automatic accurate alignment system An automatic accurate alignment system for positioning at a required position an object to be worked which has a certain pattern on its surface. The system includes a key pattern memory, a pattern matching device and movement control device. The key patte... | 01/19/1988 |
| 4705016 | Precision device for reducing errors attributed to temperature change reduced A precision device including a holding mechanism for holding an object and a supporting mechanism for supporting an operating element, one of which is movable in a predetermined direction. The precision device includes a detecting device for detecting the... | 11/10/1987 |
| 4696712 | Semiconductor wafer mounting and cutting system A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cu... | 09/29/1987 |
| 4693036 | Semiconductor wafer surface grinding apparatus A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface o... | 09/15/1987 |
| 4688540 | Semiconductor wafer dicing machine A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means dispos... | 08/25/1987 |
| 4672557 | Automatic accurate alignment system An accurate alignment system for positioning at a required position an object to be worked which has on its surface straight-line areas whose image density changes relatively abruptly at their both side edges. The system comprises holding means for holdin... | 06/09/1987 |
| 4652135 | Article holding apparatus and its use An article holding apparatus provided with a plate on which an article is placed. A light transmitting opening is formed in the plate. There is provided an optical system optically connected to the light transmitting opening. Reflection light from a part ... | 03/24/1987 |
| 4603609 | Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer The invention provides an apparatus for cutting a sheet-like member such as an adhesive tape applied to a surface of a semiconductor wafer at the periphery of said semiconductor wafer. The apparatus comprises a heating rod to be brought into contact with the ... | 08/05/1986 |
| 4565034 | Grinding and/or cutting endless belt For adaptation to grinding or cutting precise or minute parts, a grinding and/or cutting endless belt is made of grindstone comprising electrodeposited abrasive grains.... | 01/21/1986 |
| 4547998 | Electrodeposited grinding tool An electrodeposited grinding tool having an electrodeposited abrasive layer formed by electrodepositing abrasive grains to an electrodeposition thickness at least three times as large as the diameter of the abrasive grains. Pores are dispersed in the elec... | 10/22/1985 |
