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Assignee: Covalent Materials Corporation


Location: Tokyo, JP
No. of patents: 20

NumberTitleIssue Date
8148753Compound semiconductor substrate having multiple buffer layers
The present invention provides a compound semiconductor substrate, including: a single-crystal silicon substrate having a crystal face with (111) orientation; a first buffer layer which is formed on the single-crystal silicon substrate and is constituted of an Al
04/03/2012
8143557Plane heater
To provide a plane heater, including a carbon wire heating element CW, in which surface arrangement density of the heating element CW in an outer area is denser than that in an inner area. A power supply terminal unit having connection wires for supplying electricit...
03/27/2012
8071920Planar heater
A planar heater 1 in which a power supply terminal unit 108 which supplies an electric power is arranged on a central portion on a lower surface of a silica glass plate-like member 102. The power supply terminal unit includes small-diameter sili...
12/06/2011
7977219Manufacturing method for silicon wafer
In a manufacturing method for a silicon wafer, a first heat treatment process is performed on the silicon wafer while introducing a first gas having an oxygen gas in an amount of 0.01 vol. % or more and 1.00 vol. % or less and a rare gas, and a second heat treatment...
07/12/2011
7909931Silica glass crucible
The present invention provides a silica glass crucible for manufacturing a silicon single crystal, in which melt vibration can be controlled more certainly and a high yield of single crystal can be realized. A first substantially bubble-free layer 10a ...
03/22/2011
7679730Surface inspection apparatus and surface inspection method for strained silicon wafer
An image pickup device disposed in a predetermined position relative to a surface of a strained silicon wafer photographs the surface of the strained silicon wafer in a plurality of rotation angle positions on photographing conditions under which bright lines appear...
03/16/2010
7608553Transparent rare-earth oxide sintered body and manufacturing method thereof
The invention intends to obtain a transparent yttrium oxide sintered body of which in-line transmittance in a visible wavelength region of 400 to 800 nm at a thickness of 1 mm is 60% or more, without using aluminum that readily segregates in grain boundaries of yttr...
10/27/2009
7588638Single crystal pulling apparatus
A single crystal pulling apparatus having a heater 4 melting material silicon by thermal radiation from a cylindrical exothermic part 4a which surrounds a crucible 3 inside a furnace body 2 and an electromagnet 13 which is p...
09/15/2009
7514364Hydrophilicity treatment method of a silicon wafer
In a hydrophilicity treatment method including the step of rotating, on a polishing cloth, a mirror surface of a silicon wafer subjected to mirror-polishing followed by rinsing treatment while the mirror surface is pushed onto the cloth under the application of a sm...
04/07/2009
7485593Titania-silica glass
To provide titania-silica glass which is transparent glass of low thermal expansion, in particular, is of a low thermal expansion coefficient over a wide range of temperatures of 0 to 100° C. (an operating temperature range) when it is used as a photomask or a mirr...
02/03/2009
7476634Yttria sintered body and manufacturing method therefor
To provide a yttria sintered body having an excellent corrosion resistance to halogen-based corrosive gases and plasma and an excellent thermal shock resistance, and adapted for use as a component member in manufacturing apparatuses for semiconductor and liquid crys...
01/13/2009
7403278Surface inspection apparatus and surface inspection method
A surface inspection apparatus, for inspecting a plurality of surfaces formed in a peripheral edge portion of a plate-like object, includes a image pickup mechanism, which photographs the peripheral edge portion of the plate-like object having a plurality of surface...
07/22/2008
7396409Acicular silicon crystal and process for producing the same
By uniformly forming an indefinite number of microscopic acicular crystals on a surface of a silicon substrate so as to be perpendicular to the surface of the substrate by plasma CVD method using a catalyst, it is possible to reliably, homogeneously and massively fo...
07/08/2008
7393418Susceptor
A susceptor at least a surface thereof being coated with SiC, includes a recess where an wafer is mounted, the recess having an round portion disposed on a lower portion of an outer circumferential portion of the recess, a ring-shaped SiC crystal growth surface port...
07/01/2008
7381362Production method for ceramic porous material
To provide a method for producing a ceramic porous material which has a high strength, though it has a high porosity, and which is excellent in permeability without dust generation. In a ceramic porous material having a three-dimensional mesh-like skeleton structure...
06/03/2008
7374955Method of manufacturing silicon wafer
The present invention provides a method of manufacturing a silicon wafer where a defect does not exist at a wafer surface layer part on which a device is formed, without affecting productivity and production costs of the wafer. An ingot of a silicon single cr...
05/20/2008
7368757Compound semiconductor and compound semiconductor device using the same
A back electrode 6 is formed in the back of a Si single crystal substrate 2 of a compound semiconductor in which an n-type 3C-SiC single crystal buffer layer 3 having a thickness of 0.05-2 μm, a carrier concentration of 1016-102...
05/06/2008
7336892Reflection plate for semiconductor heat treatment and manufacturing method thereof
It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is...
02/26/2008
7291220Process of producing silicon wafer
A silicon wafer made by the Czochralski method, including a ring-shaped OSF region and having nitrogen concentration ranging from 2.9×1014 to 5.0×1015 atoms/cm3 and oxygen concentration of 1.27×1018 to 3.0×1018
11/06/2007
7262485Substrate for growing electro-optical single crystal thin film and method of manufacturing the same
A substrate 1 for growing an electro-optical single crystal thin film in which two or more layers of buffer layers 3, 4, and 5 for buffering lattice mismatch between Si and BTO are formed on an Si (001) substrate 2 is provided as a substr...
08/28/2007
 
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