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Assignee: Coolit Systems Inc.


Location: Calgary, Alberta, CA
No. of patents: 2

NumberTitleIssue Date
7604040Integrated liquid cooled heat sink for electronic components
A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper porti...
10/20/2009
7597135Impingement cooled heat sink with low pressure drop
Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a prim...
10/06/2009
 
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