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Assignee: Cheil Industries Inc.


Location: Taegu, KR
No. of patents: 14

NumberTitleIssue Date
6365669Method for preparing polybutadiene latex
A method for preparing a polybutadiene latex comprises providing an emulsion polymerization medium by reacting a mixture of water, butadiene monomers, a surfactant, a chain transfer agent, an initiator and an electrolyte, preferably at a temperature of ab...
04/02/2002
5985993Method for preparing polybutadiene latex
A method for preparing a polybutadiene latex comprises providing an emulsion polymerization medium by reacting water, butadiene monomers, a surfactant, a chain transfer agent, an initiator and an electrolyte, preferably at a temperature of about 60~80° C...
11/16/1999
5965666Thermoplastic resin composition with high impact strength at low temperatures
This invention relates to a resin composition having high impact strength at low temperatures, comprising a polyamide, a graft copolymer obtained by graft polymerizing a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer to a conjuga...
10/12/1999
5952408Flameproof thermoplastic resin compositions
The present invention relates to flameproof thermoplastic resin compositions comprising (A) a base resin comprising (1) 75 to 96% by weight of a thermoplastic, halogen-free polycarbonate, (2) 4 to 25% by weight of a styrene-containing graft copolymer, and...
09/14/1999
5834558Weather resistant theromplastic resin composition
A styrenic thermoplastic resin composition comprising a mixture of: (A) 50-90 wt % of a styrenic polymer; (B) 5-35 wt % of a chlorinated polyethylene; (C) 5-35 wt % of a modified ethylene-propylenic rubber; and (D) 0-10 wt % of vinyl graft copolymer has s...
11/10/1998
5747587HCFC resistant resin composition
The resin composition for preparing an internal box of a refrigerator according to the present invention comprises (A) a graft polymer obtained by grafting of a monomer mixture comprising a vinyl cyanide compound and an aromatic vinyl compound to a conjug...
05/05/1998
5674924Flameproof thermoplastic resin compositions
The present invention relates to flameproof thermoplastic resin compositions comprising (A) a base resin consisting of (1) 80 to 96% by weight of a thermoplastic, halogen-free polycarbonate, and (2) 4 to 20% by weight of a core-shell type ABS resin with a...
10/07/1997
5665821Polyphenylene ether resin compositions
The present invention relates to resin compositions having a good compatibility of polyphenylene ether and polyamide and a natural color, which comprise (A) 5 to 95 parts by weight of a polyphenylene ether, (B) 1 to 50 parts by weight of a functionalized ...
09/09/1997
5643981Flameproof thermoplastic resin compositions
The flameproof thermoplastic resin compositions of this invention comprise from 2 to 20 parts by weight of aromatic diphosphates, from 2 to 7 parts by weight of phosphorous compounds and from 0.1 to 2.0 parts by weight of polyfluoroalkyl resins per 100 pa...
07/01/1997
5553357High bulky wool spun yarn and a drafting apparatus for preparing the yarn
A high bulky wool spun yarn for knitting or weaving, which has high bulky properties formed by bulky loops in the bundle of the yarn, and a drafting system for making the same is provided. The drafting system includes a spinning machine with an improved f...
09/10/1996
5428057New maleimide modified epoxy resin and a method for the preparation thereof
The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared b...
06/27/1995
5212277Polyetherimideimides and a method for manufacturing them
The present invention relates to new polyetherimideimides having imideimide group with the following structural formula(I) and inherent viscosity of 0.27~0.71 dl/g, which can be made by effecting reaction between an aromatic bis(ether anhydride) and an or...
05/18/1993
5210115Allyl magnesium halide modified epoxy resin composition
A modified epoxy resin of the general formula (I) is prepared by dissolving an epoxy resin in a solvent, adding the mixture to allyl magnesium halide at -70° C. under a nitrogen atmosphere, and removing the solvent and salts from the resultant product. T...
05/11/1993
5189082Imide epoxy resins for sealing semiconductor elements
The present invention relates to novel epoxy resin compositions for sealing semiconductor elements, which comprise 0.1 to 20.0% by weight of imide-epoxy resins represented by the general formula (I) together with epoxy resins, curing agents, curing promot...
02/23/1993
 
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