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Assignee: Chapman Instruments Inc.


Location: Rochester, NY
No. of patents: 5

NumberTitleIssue Date
7283256Method and apparatus for measuring wafer thickness
A system for non-contact measurement of thickness of a test object. A laser beam is split into two identical directly opposed input beams. A calibration object of known thickness causes beams to be reflected from sides of the test object. Each reflected beam passes ...
10/16/2007
7280232Method and apparatus for measuring wafer thickness
A system for non-contact measurement of thickness of an object. A laser beam is split into two identical input beams that are directly opposed. A calibration object of known thickness causes beams to be reflected from sides of the test object. Each reflected beam pa...
10/09/2007
6342705System for locating and measuring an index mark on an edge of a wafer
In a system for locating and measuring an index mark on an edge of a wafer, a wafer to be examined is positioned and centered on a chuck in a horizontal chuck position such that an index mark is oriented within first and second index mark orientation feat...
01/29/2002
6157450Automated optical surface profile measurement system
A fully automated surface profiling system having a loading chamber and an adjacent measurement chamber containing a phase differential laser optical scanning system and a five-axis positioner having a vacuum chuck for holding and orienting a wafer for su...
12/05/2000
5986753Wafer holding and orienting fixture for optical profilometry
An optical profilometer having a movable head for measurement of the profile of a surface of a wafer under test in response to an optical beam projected by the head and incident onto the surface. The wafer may be a substrate for a data storage disc, and t...
11/16/1999
 
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