Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 8184453 | Increased capacity semiconductor package Disclosed is a lead frame and a semiconductor device including the same. The lead frame is provided with a die pad, and first, second and third lands sequentially arranged on an outer circumferential edge. The lead frame can separate the first and second lands or th... | 05/22/2012 |
| 8183683 | Semiconductor device and fabricating method thereof A semiconductor device is provided. The semiconductor device comprises a semiconductor die having bond pads, each of which consists of a first bond pad made of a material whose ionization tendency is relatively low and a second bond pad made of a material whose ioni... | 05/22/2012 |
| 8176628 | Protruding post substrate package structure and method In accordance with one embodiment, a method of forming a protruding post substrate package includes applying a dielectric layer to a carrier. Via apertures are formed in the dielectric layer. Carrier cavities are formed in the carrier using the dielectric layer as a... | 05/15/2012 |
| 8154111 | Near chip size semiconductor package A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electrical connect... | 04/10/2012 |
| 8143727 | Adhesive on wire stacked semiconductor package A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is... | 03/27/2012 |
| 8129849 | Method of making semiconductor package with adhering portion Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range... | 03/06/2012 |
| 8129824 | Shielding for a semiconductor package A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the firs... | 03/06/2012 |
| 8125064 | Increased I/O semiconductor package and method of making same In accordance with the present invention, there is provided a semiconductor package and a fabrication method thereof. The semiconductor package is provided with a substrate made of metal, thereby improving efficiency of thermal emission from a semiconductor die moun... | 02/28/2012 |
| 8119455 | Wafer level package fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 02/21/2012 |
| 8115283 | Reversible top/bottom MEMS package A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover ... | 02/14/2012 |
| 8110909 | Semiconductor package including top-surface terminals for mounting another semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 02/07/2012 |
| 8102037 | Leadframe for semiconductor package A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is... | 01/24/2012 |
| 8102032 | System and method for compartmental shielding of stacked packages A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substr... | 01/24/2012 |
| 8093691 | System and method for RF shielding of a semiconductor package A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first sur... | 01/10/2012 |
| 8089159 | Semiconductor package with increased I/O density and method of making the same The present invention is related to a semiconductor package and method for fabricating the same wherein the semiconductor package includes a die pad having a semiconductor die mounted thereto, and two or more sets of leads or I/O pads which extend at least partially... | 01/03/2012 |
| 8089148 | Circuit board and semiconductor device having the same A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mountin... | 01/03/2012 |
| 8089145 | Semiconductor device including increased capacity leadframe In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly... | 01/03/2012 |
| 8089141 | Semiconductor package having leadframe with exposed anchor pads A semiconductor package including a leadframe which has one or more anchor pads formed on and/or defined by the die pad thereof. Such anchor pad(s) may be provided in any one of a multiplicity of different pad shapes, and are adapted to satisfy the required mechanic... | 01/03/2012 |
| 8084868 | Semiconductor package with fast power-up cycle and method of making same In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate throu... | 12/27/2011 |
| 8072083 | Stacked electronic component package having film-on-wire spacer A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic co... | 12/06/2011 |
| 8072058 | Semiconductor package having a plurality input/output members A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by... | 12/06/2011 |
| 8072050 | Semiconductor device with increased I/O leadframe including passive device In accordance with the present invention, there are provided multiple embodiments of a semiconductor package, each embodiment including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor packag... | 12/06/2011 |
| 8067821 | Flat semiconductor package with half package molding In accordance with the present invention, there are provided multiple embodiments of a semiconductor package, each embodiment including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor packag... | 11/29/2011 |
| 8058726 | Semiconductor device having redistribution layer A semiconductor device and method of manufacturing the same are provided. The semiconductor device comprises a semiconductor die including a bond pad, a redistribution layer, and a solder ball. The redistribution layer is formed by sequentially plating copper and ni... | 11/15/2011 |
| 8058715 | Package in package device for RF transceiver module In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including an RF package and a semiconductor die which are provided in a stacked arrangement and are each electrically connected to an underl... | 11/15/2011 |
| 8030722 | Reversible top/bottom MEMS package A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die ... | 10/04/2011 |
| 8026589 | Reduced profile stackable semiconductor package In accordance with the present invention, there is provided multiple embodiments of a reduced profile stackable semiconductor package. The semiconductor package comprises a substrate having at least one semiconductor die attached thereto. The semiconductor die is al... | 09/27/2011 |
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 09/27/2011 |
| 8022521 | Package failure prognostic structure and method In accordance with one embodiment, a failure prognostic package includes a substrate having a first surface and an opposite second surface. An electronic component trace is coupled to the first surface. An electronic component is electrically coupled to the electron... | 09/20/2011 |
| 8018072 | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate A semiconductor device has a substrate. A die is attached to a first surface of the substrate. A heat sink is provided having an approximately planer member and support members extending from the planer member. The support members are attached to the first surface o... | 09/13/2011 |
| 8018068 | Semiconductor package including a top-surface metal layer for implementing circuit features A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a confor... | 09/13/2011 |
| 8017436 | Thin substrate fabrication method and structure A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material a... | 09/13/2011 |
| 8008758 | Semiconductor device with increased I/O leadframe In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly... | 08/30/2011 |
| 8008753 | System and method to reduce shorting of radio frequency (RF) shielding An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to ... | 08/30/2011 |
| 8004078 | Adhesive composition for semiconductor device Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of therm... | 08/23/2011 |
| 7999371 | Heat spreader package and method A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes a... | 08/16/2011 |
| 7994045 | Bumped chip package fabrication method and structure A method of fabricating a bumped chip package includes forming a first seed layer on a dielectric layer, the dielectric layer comprising a dielectric layer opening exposing a substrate terminal of a substrate, the first seed layer being formed within the dielectric ... | 08/09/2011 |
| 7994043 | Lead free alloy bump structure and fabrication method A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the firs... | 08/09/2011 |
| 7989933 | Increased I/O leadframe and semiconductor device including same In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly... | 08/02/2011 |
| 7982316 | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof A semiconductor package and method of fabricating has a substrate having conductive patterns formed thereon. A semiconductor die is attached to the substrate. An electrically connecting member is electrically coupled to the semiconductor die and the conductive patte... | 07/19/2011 |
