Bizarre Patents
Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
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| Number | Title | Issue Date |
| 8072489 | Digital camera module using stacked chip package A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the sub... | 12/06/2011 |
| 8059155 | System and method for measuring field of view of digital camera modules A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The param... | 11/15/2011 |
| 7646429 | Digital camera module packaging method A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base... | 01/12/2010 |
| 7643081 | Digital camera module with small sized image sensor chip package A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engag... | 01/05/2010 |
| 7639303 | Method and apparatus for lens auto-focusing in camera module test A lens auto-focusing method in camera module testing includes the following steps: providing testing equipment including a range finder, a signal processor and a driving member; providing an imaged object (20); providing an camera module including a lens modu... | 12/29/2009 |
| 7626160 | Image sensing module with improved assembly precision An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and... | 12/01/2009 |
| 7614807 | Electronic camera mechanism An exemplary camera mechanism (8) includes a lens module (10), an image sensor module (20), an electronic module (30), and a transmission module (40). The image sensor module is mounted under the lens module. The electronic module ... | 11/10/2009 |
| 7592197 | Image sensor chip package fabrication method An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an ... | 09/22/2009 |
| 7554184 | Image sensor chip package A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area ( | 06/30/2009 |
| 7540672 | Digital still camera module A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The sub... | 06/02/2009 |
| 7538862 | Testing system for digital camera modules A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main p... | 05/26/2009 |
| 7515254 | Reflection-testing device and method for use thereof A reflection-testing device for testing for unwanted reflections in a lens module (12) includes a plurality of light sources (18) and an image capturer (16). The plurality of light sources is provided around the top end of the lens module, and t... | 04/07/2009 |
| 7502183 | Lens module and camera module using the same A camera module (100) includes a lens module (10) and an image sensor (20), wherein the lens module includes a barrel (12), a plurality of lenses (14) and at least one spacer between each two neighboring lenses. The barrel includes... | 03/10/2009 |
| 7460317 | Digital camera module with improved image quality A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The l... | 12/02/2008 |
| 7417810 | Lens module with shielding layer A lens module (200) includes a barrel (20), a lens (30) and a shielding layer (51). The barrel includes a screening end (21) and a mounting end (22) positioned opposite to the screening end, and defines an aperture (23 | 08/26/2008 |
| 7408205 | Digital camera module A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in... | 08/05/2008 |
| 7374431 | Clamping device for digital camera module A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate su... | 05/20/2008 |
| 7365421 | IC chip package with isolated vias An IC chip package includes a substrate (2), a chip (5), a plurality of bonding wires (52), and a cover (6). The substrate has a top surface, a receiving chamber (23) having an opening at the top surface, a plurality of solder pads... | 04/29/2008 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip pack... | 04/22/2008 |
| 7342215 | Digital camera module package fabrication method A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322... | 03/11/2008 |
