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Assignee: Akustica, Inc.


Location: Pittsburgh, PA
No. of patents: 10

NumberTitleIssue Date
8144906Wind immune microphone
Disclosed is an acoustic device comprising an enclosed housing defining an inner volume and having a front and a back; an acoustic port penetrating the front of the enclosed housing; a first and second sense structure attached to the inside of the housing and defini...
03/27/2012
8094980Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricating the same
Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least o...
01/10/2012
7863714Monolithic MEMS and integrated circuit device having a barrier and method of fabricating the same
An integrated circuit device includes a semiconductor die, the semiconductor die including a semiconductor substrate, driving/control circuitry disposed along a peripheral region of the semiconductor die, a MEMS device disposed within a central region of the semicon...
01/04/2011
7824943Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and e...
11/02/2010
7763488Method of fabricating MEMS device
A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded...
07/27/2010
7640805Proof-mass with supporting structure on integrated circuit-MEMS platform
Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least o...
01/05/2010
7202101Multi-metal layer MEMS structure and process for making the same
The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, a...
04/10/2007
7049051Process for forming and acoustically connecting structures on a substrate
The present invention describes a processes that builds an acoustic cavity, a chamber, and vent openings for acoustically connecting the chamber with the acoustic cavity. The dry etch processes may include reactive ion etches, which include traditional parallel plat...
05/23/2006
6943448Multi-metal layer MEMS structure and process for making the same
The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, a...
09/13/2005
6936524Ultrathin form factor MEMS microphones and microspeakers
A process comprises reducing the thickness of a substrate carrying a plurality of devices, with at least certain of the devices having a micro-machined mesh. A carrier wafer is attached to the back side of the substrate and the fabrication of the devices is complete...
08/30/2005
 
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