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| Number | Title | Issue Date |
| 6538331 | Semiconductor device and a method of manufacturing the same Two memory chips mounted over a base substrate have the same external size and a flash memory of the same memory capacity formed thereon. These memory chips are mounted over the base substrate with one of them being overlapped with the upper portion of th... | 03/25/2003 |
| 6515371 | Semiconductor device with elastic structure and wiring A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elast... | 02/04/2003 |
| 5587341 | Process for manufacturing a stacked integrated circuit package In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of hig... | 12/24/1996 |
