Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8092914 | Heat sink substrate and production method for the same A heat sink substrate has a composite structure including a three-dimensional network structure of SiC ceramic having pores infiltrated with Si, and has a thermal conductivity of not less than 150 W/m·K and an oxygen content of not greater than 7 ppm. The heat sink... | 01/10/2012 |
| 8025710 | Tungsten alloy grains, processing method using the same, and method for manufacturing the same Provided are an ancillary material, used for shape processing, which is capable of shortening a processing time, avoiding a reduction in quality of a shape provided to a workpiece material, and allowing a relatively low manufacturing cost; a processing method using ... | 09/27/2011 |
| 7926478 | Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surf... | 04/19/2011 |
| 7883775 | Diamond film coated tool and process for producing the same The invention provides a diamond coated tool having an excellent cutting performance, wear resistance, adhesion resistance and work surface roughness in combination and a method of producing such a tool. A diamond coated tool comprising a substrate and a diam... | 02/08/2011 |
| 7768120 | Heat spreader and semiconductor device using the same The present invention provides a heat spreader 1 which includes a substrate 7 composed of a metal-containing material and in which a second-component connection surface 6 of the substrate 7 is provided with wettability with a solder and a... | 08/03/2010 |
| 7749430 | Member for semiconductor device and production method thereof A member for a semiconductor device of low price, capable of forming a high quality plating layer on a surface, having heat conductivity at high temperature (100° C.) of more than or equal to 180 W/m·K and toughness that will not cause breaking due to screwing, an... | 07/06/2010 |
| 7556456 | Mono crystalline diamond cutting tool for ultra precision machining A mono crystalline diamond cutting tool is provided which can perform ultra precision machining on a crystalline material or a hard and brittle material with good swarf discharge and reduced cutting resistance to improve a precision of a cut surface, and has less we... | 07/07/2009 |
| 7470982 | Substrate for semiconductor device and semiconductor device A configuration for a substrate for a semiconductor device which makes it possible to achieve further stabilization of the voltage for driving a semiconductor element (5) to be mounted is provided. The substrate for a semiconductor device is provided with a b... | 12/30/2008 |
| 7442225 | High strength high toughness Mo alloy worked material and method for production thereof The present invention provides a worked molybdenum-alloy material that can be used at higher temperatures than at least temperatures at which known TZM alloys are used. A worked molybdenum-alloy material having high strength and high toughness includes at lea... | 10/28/2008 |
| D545332 | Wire saw | 06/26/2007 |
| D534933 | Wire saw | 01/09/2007 |
| D533203 | Wire saw | 12/05/2006 |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and coppe... | 08/01/2006 |
