Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8139344 | Electrolytic capacitor assembly and method with recessed leadframe channel A solid electrolytic capacitor has a capacitor body formed from a pressed anode, a dielectric layer and a solid electrolyte layer. An anode lead extends from anode pellet and is electrically connected to an anode termination. The outer surface of the capacitor body ... | 03/20/2012 |
| 8125768 | External coating for a solid electrolytic capacitor A solid electrolytic capacitor that includes an anode body, a dielectric overlying the anode body, a solid electrolyte that contains one or more conductive polymers and overlies the dielectric, and an external coating that overlies the solid electrolyte, is provided... | 02/28/2012 |
| 8114340 | Method of forming anode bodies for solid state capacitors The present invention relates to the field of solid state capacitors, and in particular to capacitors that have an anode body formed of porous valve action material, such as tantalum, niobium or niobium monoxide. According to one aspect of the present invention, the... | 02/14/2012 |
| 8109783 | Insulation displacement connector (IDC) An electrical insulation displacement connector includes a bare single-wire contact element having a first end defined by opposed blades that define a receipt aperture for an insulated wire, and a second end configured for direct electrical contact at a contact posi... | 02/07/2012 |
| 8094434 | Hermetically sealed capacitor assembly A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe tha... | 01/10/2012 |
| 8075640 | Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency A surface-mountable electrolytic capacitor with improved volumetric efficiency includes an electrolytic capacitor element, anode and cathode terminations, an encapsulation material and external terminations. The capacitor element has first and second opposing end su... | 12/13/2011 |
| 8043109 | Wire to board connector An electrical connector configured for connecting wires to components includes a female component defining a socket with electrical contacts therein. A male component includes an insulative base body with contacts having a first section configured for receipt of a c... | 10/25/2011 |
| 8023250 | Substrate for use in wet capacitors A porous substrate for use in a wide variety of applications, such as wet capacitors, is provided. The substrate is formed by subjecting a metal substrate to a voltage while in solution to initiate anodic formation of an oxide film. Contrary to conventional anodizat... | 09/20/2011 |
| 7976334 | Capped insulation displacement connector (IDC) An electrical insulation displacement connector (IDC) assembly includes a body having at least one channel with an open top side configured for receipt of an insulated conductive core wire therein. A contact element is fixed in the body with a first insulation displ... | 07/12/2011 |
| 7955116 | Insulation displacement connector (IDC) An electrical insulation displacement connector includes a body having at least one channel with an open top side configured for receipt of an insulated conductive core wire therein. A contact element is fixed in the body with a first insulation displacement end def... | 06/07/2011 |
| 7938866 | Solid electrolytic capacitor containing a conductive polymer A method for forming an electrolytic capacitor is disclosed. The method includes forming a conductive polymer coating over the dielectric layer by polymerizing a monomer in the presence of an oxidative polymerization catalyst. The conductive polymer coating is forme... | 05/10/2011 |
| 7931489 | Wire to board connector An electrical connector for connecting wires to components includes an insulative body member having a longitudinally extending leg defined between opposite longitudinal ends. A plurality of spaced apart side walls define adjacently disposed connector positions alon... | 04/26/2011 |
| 7889020 | Asymmetrical filter Disclosed is methodology and apparatus for producing an asymmetrical filter for use with implantable medical devices, and in other input filtering environments. Differing forward and reverse characteristic responses are provided by inserting a low value resistor in ... | 02/15/2011 |
| 7867291 | Laser-welded solid electrolytic capacitor A solid electrolytic capacitor that is capable of withstanding laser welding without a significant deterioration in its electrical performance is provided. The capacitor contains an anode body, dielectric layer overlying the anode body, and a solid organic electroly... | 01/11/2011 |
| 7857668 | Connector module for ruggedized applications A connector module can be configured to provide a connection between a component such as an electrolytic capacitor and a circuit board while supporting the component in a spaced apart manner from the board Due to the connector module, secondary soldering operations ... | 12/28/2010 |
| 7852615 | Electrolytic capacitor anode treated with an organometallic compound An electrolytic capacitor that contains an anodically oxidized anode that is incorporated with an additional metallic element is provided. More specifically, the metallic element is built into the valve metal pentoxide of the dielectric layer. In one particular embo... | 12/14/2010 |
| 7833045 | Insulation displacement connector (IDC) An electrical insulation displacement connector includes a body having at least one channel with an open top side configured for receipt of an insulated conductive core wire therein. A contact element is fixed in the body with a first insulation displacement end def... | 11/16/2010 |
| 7832618 | Termination bonding Disclosed are methodologies for producing lead type electrical components. Components are placed in a lead frame with termination paste applied to selected portions of the component. Upon firing of the assembled lead frame and electrical components, the electrical c... | 11/16/2010 |
| 7826200 | Electrolytic capacitor assembly containing a resettable fuse A fused electrolytic capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the fused electrolytic capacitor assembly contains an electrolytic capacitor element and a resettable fu... | 11/02/2010 |
| 7808434 | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices Embodiments of the invention may provide for a variety of antennae structures, including the following: a) antennae structures printed directly on the sides of the radio frequency (RF) module or integrated passive device (IPD), b) printed antennae structures fabrica... | 10/05/2010 |
| 7780468 | Wire to board connector An electrical connector for connecting wires to components includes an insulative body member having a longitudinally extending leg defined between opposite longitudinal ends. A plurality of spaced apart side walls define adjacently disposed connector positions alon... | 08/24/2010 |
| 7768773 | Sintered anode pellet etched with an organic acid for use in an electrolytic capacitor An electrolytic capacitor anode etched with an organic acid prior to anodic oxidation of the anode to create the dielectric layer. Without intending to be limited by theory, it is believed that the organic acid can etch away at least a portion of any oxides on the a... | 08/03/2010 |
| 7766668 | Low profile electrical conductor assembly for interconnecting conductive components in a stacked configuration A thin profile electrical connector assembly for interconnecting conductive components, such as circuit boards, in a stacked configuration, includes a frame-shaped insulating body member having opposite ends and opposite leg members. A plurality of adjacently dispos... | 08/03/2010 |
| 7760488 | Sintered anode pellet treated with a surfactant for use in an electrolytic capacitor An electrolytic capacitor anode treated with a surfactant during anodic oxidation is provided. Without intending to be limited by theory, it is believed that the surfactant may lower the surface tension of an electrolyte, which inhibits the clustering of grown oxide... | 07/20/2010 |
| 7760487 | Doped ceramic powder for use in forming capacitor anodes An electrolytic capacitor that includes an anode body formed from a powder comprising electrically conductive ceramic particles and a non-metallic element in an amount of about 100 parts per million or more is provided in one embodiment of the invention. The non-met... | 07/20/2010 |
| 7724502 | Laser-welded solid electrolytic capacitor A solid electrolytic capacitor that is capable of withstanding laser welding without a significant deterioration in its electrical performance is provided. The capacitor contains an anode body, dielectric layer overlying the anode body, and a solid organic electroly... | 05/25/2010 |
| 7724496 | Multilayer vertically integrated array technology The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal filtering characteristics, over-voltage transient suppression capabilitie... | 05/25/2010 |
| 7714688 | High Q planar inductors and IPD applications Disclosed is methodology and apparatus for producing a planar inductor having a high quality (Q) factor. The inductor is formed by providing a first, relatively wide coil turn, and at least a pair of relatively more narrow second coil turns, displaced in a different... | 05/11/2010 |
| 7697262 | Multilayer ceramic capacitor with internal current cancellation and bottom terminals Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where terminatio... | 04/13/2010 |
| 7656647 | Electrolytic capacitor with improved volumetric efficiency Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent... | 02/02/2010 |
| 7649730 | Wet electrolytic capacitor containing a plurality of thin powder-formed anodes A wet electrolytic capacitor that includes a plurality of anodes, cathode, and working electrolyte that is disposed in electrical contact with the anodes and current collector is provided. Any number of anodes may generally be employed, such as from 2 to 40, in some... | 01/19/2010 |
| 7641933 | Integrated capacitor assembly A single layer capacitive device including a portion of pre-fired ceramic material and one or more terminations is formed with manufacturing steps that are easily modified to customize size and other aspects of such devices. The single layer devices may be utilized ... | 01/05/2010 |
| 7599191 | Electrochemical low ESR capacitor with connector An electrochemical double layer capacitor (DLC) is configured for mounting on a PCB. A first connector component is configured at each individual terminal lead of the DLC capacitor. A second connector component is mounted on the PCB and includes a number of parallel... | 10/06/2009 |
| 7576968 | Plated terminations and method of forming using electrolytic plating A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes ... | 08/18/2009 |
| 7573698 | Window via capacitors A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. Fi... | 08/11/2009 |
| 7532457 | Fused electrolytic capacitor assembly A fused electrolytic capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the fused electrolytic capacitor assembly contains an electrolytic capacitor element and a surface mount... | 05/12/2009 |
| 7511943 | Wet electrolytic capacitor containing a cathode coating A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a substrate and a coating overlying the substrate. The coating comprises a sintered body containing carbonaceous particles (e.g., activated carbon) and... | 03/31/2009 |
| 7480130 | Wet electrolytic capacitor A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto. The metal particles have a median size of from about 20 ... | 01/20/2009 |
| 7468882 | Solid electrolytic capacitor assembly An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a first solid electrolytic capacitor element and second solid electrolytic capa... | 12/23/2008 |
| 7463474 | System and method of plating ball grid array and isolation features for electronic components A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of first and second polarity electrode layers. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of t... | 12/09/2008 |
