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| Number | Title | Issue Date |
| 7695269 | Apparatus and method for in-mold degating An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which... | 04/13/2010 |
| 7681775 | Multi-layer thermal insulation for a bonding system A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at lea... | 03/23/2010 |
| 7677431 | Electronic device handler for a bonding apparatus A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the e... | 03/16/2010 |
| 7628307 | Apparatus for delivering shielding gas during wire bonding An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main bo... | 12/08/2009 |
| 7618249 | Memory card molding apparatus and process A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is con... | 11/17/2009 |
| 7614540 | Thermal insulation for a bonding tool A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat. ... | 11/10/2009 |
| 7578423 | Assembly for reducing oxidation of semiconductor devices An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for providing access by a bonding tool to bonding areas where the semiconduc... | 08/25/2009 |
| 7572675 | Mold flash removal process for electronic devices A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolde... | 08/11/2009 |
| 7568606 | Electronic device handler for a bonding apparatus A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic ... | 08/04/2009 |
| 7549569 | Wire clamp gap control mechanism and method An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actua... | 06/23/2009 |
| 7544539 | Forced heat transfer apparatus for heating stacked dice An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet positionable adjacent to the first die is configured to project a hot gas onto ... | 06/09/2009 |
| 7537148 | Bonding apparatus comprising improved oscillation amplification device A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic d... | 05/26/2009 |
| 7532428 | Soft touch clamp actuation mechanism A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is opera... | 05/12/2009 |
| 7531979 | Direct drive robotic manipulator A direct drive robotic manipulator is provided which includes a plurality of segments that are rotatably coupled with respect to one another. A plurality of spindles connects the segments for relative rotation therebetween, and a plurality of direct drive assemblies... | 05/12/2009 |
| 7427009 | Capillary for wire bonding A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of th... | 09/23/2008 |
| 7378616 | Heating apparatus and method for semiconductor devices A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over... | 05/27/2008 |
| 7327054 | Linear actuator comprising velocity sensor A linear actuator for a motion system is provided with a velocity sensor for monitoring a velocity of an actuation arm that it is driving. The linear actuator comprises a magnetic field, a first coil that is controllably movable within the magnetic field by adjustin... | 02/05/2008 |
| 7314157 | Wire bond with improved shear strength A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed su... | 01/01/2008 |
| 7306082 | Passive damping of vibrations in a support structure A support structure supporting a movable component is provided with a vibration damper in the form of at least one cavity in the structure, the cavity being filled with a composite material; preferably a composite material of about 80% butyl rubber and 20% carbon pa... | 12/11/2007 |
| 7305757 | Die ejector system using linear motor A die ejector system and method for removing a die from an adhesive surface. The system includes an ejector tool that is operative to move relative to the die whereby to push the die. The ejector tool may consist of a collet holder and an ejector pin array. A shaft ... | 12/11/2007 |
| 7303110 | Flange-mounted transducer A flange-mounted transducer, such as an ultrasonic transducer, is provided that comprises a horn and a driver coupled to the horn for generating an oscillatory energy supply to the horn. A support structure interface is positioned at a node of longitudinal oscillato... | 12/04/2007 |
| 7303109 | Stud bumping apparatus The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas su... | 12/04/2007 |
| 7303111 | Lightweight bondhead assembly A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the b... | 12/04/2007 |
| 7241414 | Method and apparatus for molding a semiconductor device A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface... | 07/10/2007 |
| 7240820 | Clamping device for processing electronic devices A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to ... | 07/10/2007 |
| 7214606 | Method of fabricating a wire bond with multiple stitch bonds The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguou... | 05/08/2007 |
| 7202956 | Translation mechanism for opto-mechanical inspection An apparatus is disclosed for moving an optical component of an opto-mechanical inspection system relative to an object to be inspected using a linear actuator comprising a coil located in a magnetic field created by a magnet assembly. A translation stage is coupled... | 04/10/2007 |
| 7182793 | System for reducing oxidation of electronic devices The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. A holding device is provided for securing the semiconductor device to a platform. The holding device includes an opening for providin... | 02/27/2007 |
| 7108470 | Buffer device for semiconductor processing apparatus The invention provides a buffer device for a processing apparatus for semiconductor components. The apparatus comprises a transportation track for conveying semiconductor components between processing machines, and a transfer mechanism for transferring semiconductor... | 09/19/2006 |
| 7103959 | Conduit for preventing oxidation of a electronic device An apparatus to prevent oxidation of an electronic device, such as a semiconductor substrate during a semiconductor packaging process, comprises a substantially-enclosed conduit having at least one movable support defining a path through which the electronic device ... | 09/12/2006 |
| 7100812 | Capillary holder A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the ... | 09/05/2006 |
| 7064433 | Multiple-ball wire bonds The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed o... | 06/20/2006 |
| 7030504 | Sectional molding system The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative... | 04/18/2006 |
| 7025243 | Bondhead for wire bonding apparatus A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may ... | 04/11/2006 |
| 6992410 | Cooling system for motors The invention provides a cooling system and method for a motor having a movable component, which may be a moving coil bracket of a linear motor. The system comprises a fluid transmission tube extending adjacent to a heat-emitting surface of the movable component to ... | 01/31/2006 |
| 6988879 | Apparatus and method for reducing substrate warpage The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the fl... | 01/24/2006 |
| 6948387 | Clamp calibration apparatus and method The invention provides an apparatus and method to calibrate a clamp, such as a wire clamp, which is suitable for use with a wire-bonding machine for semiconductor devices. A contact means is arranged to be contacted by an arm of the clamping device and a sensing mec... | 09/27/2005 |
| 6918528 | Transducer tool holder A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to a... | 07/19/2005 |
| 6899262 | Clamping device A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable b... | 05/31/2005 |
| 6877933 | Pellet feeding system for a molding machine A feeding system (10) for epoxy mould compound (EMC) pellets which has a supply bowl (12) situated outside the clean environment (24) of a conventional automatic moulding machine (26). A tube (16) extends from the supply bowl (1... | 04/12/2005 |
