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The ice cream cone was invented at the St. Louis Worlds Fair by Ernest Hamwi in 1904. His waffle booth was next to an ice cream vendor who ran short of dishes. Hamwi rolled a waffle to hold ice cream and the cone was born.
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| Number | Title | Issue Date |
| 7482690 | Electronic components such as thin array plastic packages and process for fabricating same A process for fabricating an integrated circuit package includes establishing a plating mask on a first surface of a metal carrier. The plating mask defines a plurality of components including a die attach pad, at least one row of contact pads and at least one addit... | 01/27/2009 |
| 7449771 | Multiple leadframe laminated IC package A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a se... | 11/11/2008 |
| 7439099 | Thin ball grid array package An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity.... | 10/21/2008 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bond... | 08/12/2008 |
| 7410830 | Leadless plastic chip carrier and method of fabricating same A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that... | 08/12/2008 |
| 7381588 | Shielded integrated circuit package An integrated circuit package is provided. The package includes a die attach pad having a first side and a second side. A first semiconductor die is mounted to the first side of the die attach pad, a plurality of contact pads disposed in close proximity to the first... | 06/03/2008 |
| 7372151 | Ball grid array package and process for manufacturing same A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conducti... | 05/13/2008 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping A process for fabricating an integrated circuit package includes mounting a semiconductor die on a first surface of a metal carrier and forming electrical connections between the semiconductor die and ones of a plurality of contacts on the metal carrier. Next, using... | 05/13/2008 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same A process for fabricating an integrated circuit package. Metal is plated up on a substrate to provide a plurality of contact pads and a plurality of fiducial markings on a periphery of the contacts. A transparent mask is selectively deposited on the substrate, over ... | 04/15/2008 |
| 7348663 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/25/2008 |
| 7344920 | Integrated circuit package and method for fabricating same A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched r... | 03/18/2008 |
| 7342305 | Thermally enhanced cavity-down integrated circuit package A cavity-down ball grid includes a flexible circuit tape including a flexible tape laminated to a conductor layer. The flexible circuit tape has an aperture therein. A thermally conductive heat spreader is fixed to a first surface of the flexible circuit tape and th... | 03/11/2008 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer ... | 01/01/2008 |
| 7270867 | Leadless plastic chip carrier A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one fu... | 09/18/2007 |
| 7247526 | Process for fabricating an integrated circuit package A process for fabricating an integrated circuit package. At least a first side of a leadframe strip is selectively etched to define portions of a die attach pad and at least one row of contacts adjacent the die attach pad. A carrier strip is laminated to the first s... | 07/24/2007 |
| 7232755 | Process for fabricating pad frame and integrated circuit package A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed la... | 06/19/2007 |
| 7226811 | Process for fabricating a leadless plastic chip carrier A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor die to e... | 06/05/2007 |
| 7224048 | Flip chip ball grid array package A flip-chip ball grid array integrated circuit package with improved thermo-mechanical properties is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. A semiconductor die is flip-chip mount... | 05/29/2007 |
