Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
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| Application No. | Application Title | Issue Date |
| 20110094537 | APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least par... | 04/28/2011 |
| 20080302653 | Method And Device For Producing An Anti-Reflection Or Passivation Layer For Solar Cells The present invention relates to a method for producing an anti-reflection and/or passivation coating for solar cells. The method may include the steps of providing a silicon wafer in a deposition chamber, pre-heating said silicon wafer to a temperature above 400° C. a... | 12/11/2008 |
| 20080299775 | GAPFILL EXTENSION OF HDP-CVD INTEGRATED PROCESS MODULATION SIO2 PROCESS Methods are disclosed for depositing a silicon oxide film on a substrate disposed in a substrate processing chamber. The substrate has a gap formed between adjacent raised surfaces. A silicon-containing gas, an oxygen-containing gas, and a fluent gas are flowed into the... | 12/04/2008 |
| 20080298945 | METHODS AND APPARATUS FOR EXTENDING THE REACH OF A DUAL SCARA ROBOT LINKAGE Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm an... | 12/04/2008 |
| 20080296594 | NITRIDE OPTOELECTRONIC DEVICES WITH BACKSIDE DEPOSITION Nitride optoelectronic devices that have asymmetric double-sided structures and methods fabricating such structures are disclosed. Two n-type III-N layers are formed simultaneously over opposite sides of a substrate with substantially the same composition. Thereafter, a... | 12/04/2008 |
| 20080296304 | SLIT VALVE Embodiments of a valve assembly for a process chamber having improved seal performance are provided herein. In some embodiments, a valve assembly for a process chamber includes a housing having an opening disposed in a wall thereof and through which a substrate may be t... | 12/04/2008 |
| 20080295773 | SUBSTRATE SUPPORT, SUBSTRATE PROCESSING DEVICE AND METHOD OF PLACING A SUBSTRATE A substrate support for supporting a substrate in a processing chamber comprises a frame for carrying the substrate, at least a first fastening means fixedly attached to the frame for aligning the substrate relative to the frame, and at least a second fastening means mo... | 12/04/2008 |
| 20080293344 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavi... | 11/27/2008 |
| 20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous ... | 11/27/2008 |
| 20080293340 | METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerou... | 11/27/2008 |
| 20080293337 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted t... | 11/27/2008 |
| 20080293336 | METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled por... | 11/27/2008 |
| 20080293335 | METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact w... | 11/27/2008 |
| 20080293334 | METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous ... | 11/27/2008 |
| 20080293333 | METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve... | 11/27/2008 |
| 20080293331 | METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abras... | 11/27/2008 |
| 20080291448 | METHODS AND APPARATUS FOR FINDING A SUBSTRATE NOTCH CENTER Methods and apparatus are provided for locating a notch and/or a center of the notch of a substrate. An exemplary method includes rotating a substrate; illuminating an edge of the substrate with a light beam as the substrate rotates; detecting a change in light intensit... | 11/27/2008 |
| 20080290041 | METHODS AND APPARATUS FOR EFFICIENT OPERATION OF AN ABATEMENT SYSTEM A method of operating an electronic device manufacturing system is provided which includes the steps of receiving information with an interface, wherein the information relates to an abatement system, and shutting down a process tool and an abatement tool in response to... | 11/27/2008 |
| 20080289167 | METHODS AND APPARATUS FOR ASSEMBLING AND OPERATING ELECTRONIC DEVICE MANUFACTURING SYSTEMS A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performi... | 11/27/2008 |
| 20080293329 | METHODS AND APPARATUS FOR IDENTIFYING A SUBSTRATE EDGE PROFILE AND ADJUSTING THE PROCESSING OF THE SUBSTRATE ACCORDING TO THE IDENTIFIED EDGE PROFILE Methods, apparatus and systems are provided for processing a selected substrate having an edge profile. The invention includes receiving substrate information at a substrate processing system wherein the substrate information is associated with at least one substrate; d... | 11/27/2008 |
| 20080294282 | USE OF LOGICAL LOTS IN SEMICONDUCTOR SUBSTRATE PROCESSING In some embodiments, a method of processing substrates is provided that includes (1) grouping substrates in a plurality of substrate carriers as a logical lot; (2) processing the logical lot as if the substrates were stored in a single substrate carrier; and (3) perform... | 11/27/2008 |
| 20080286444 | In Situ Substrate Holder Leveling Method and Apparatus Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is dire... | 11/20/2008 |
| 20080274297 | Asymmetric Grounding of Rectangular Susceptor An asymmetrically grounded susceptor used in a plasma processing chamber for chemical vapor deposition onto large rectangular panels supported on and grounded by the susceptor. A plurality of grounding straps are connected between the periphery of the susceptor to the g... | 11/06/2008 |
| 20080257864 | Methods and devices to reduce defects in dielectric stack structures A variety of techniques may be employed alone or in combination to reduce the incidence of defects arising in dielectric stack structures formed by chemical vapor deposition (CVD). Incidence of a first defect type attributable to reaction between an unreacted species of... | 10/23/2008 |
| 20080260966 | PLASMA PROCESSING METHOD Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a method of controlling a plasma in a process chamber includes providing a chamber for processing a substrate and having a processing volume defin... | 10/23/2008 |
| 20080261405 | HYDROGEN ASHING ENHANCED WITH WATER VAPOR AND DILUENT GAS An oxygen-free hydrogen plasma ashing process particularly useful for low-k dielectric materials based on hydrogenated silicon oxycarbide materials. The main ashing step includes exposing a previously etched dielectric layer to a plasma of hydrogen and optional nitrogen... | 10/23/2008 |
| 20080261409 | PROCESSING DEVICE AND METHOD FOR PROCESSING A SUBSTRATE A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a fir... | 10/23/2008 |
| 20080257261 | PLASMA PROCESSING APPARATUS Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a stren... | 10/23/2008 |
| 20080248215 | DEVICE AND A PROCESS FOR DEPOSITING A METAL LAYER ON A PLASTIC SUBSTRATE The invention relates to a process and to a web deposition machine for coating a plastic substrate with at least one metal layer, in particular plastic foil for flexible, printed circuit boards, wherein before depositing a first layer onto a surface of the plastic subst... | 10/09/2008 |
| 20080245295 | DEVICE FOR THE CONTINUOUS COATING OF A STRIP-LIKE SUBSTRATE The invention relates to a device for the continuous coating of a strip-like substrate in a vacuum, especially for producing coating patterns on the substrate, with a printing roller and a backing roller, the substrate guided between the printing roller and the backing ... | 10/09/2008 |
| 20080237029 | Oxidized Barrier Layer A method and resultant produce of forming barrier layer based on ruthenium tantalum in a via or other vertical interconnect structure through a dielectric layer in a multi-level metallization. The RuTa layer in a RuTa/RuTaN bilayer, which may form discontinuous islands,... | 10/02/2008 |
| 20080230154 | ABSORBER LAYER FOR DSA PROCESSING A method of processing a substrate comprising depositing a layer comprising amorphous carbon on the substrate and then laser annealing the substrate is provided. Optionally, the layer further comprises a dopant selected from the group consisting of nitrogen, boron, phos... | 09/25/2008 |
| 20080233366 | STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTH Disclosed is a structure and method for forming a structure including a SiCOH layer having increased mechanical strength. The structure includes a substrate having a layer of dielectric or conductive material, a layer of oxide on the layer of dielectric or conductive ma... | 09/25/2008 |
| 20080230382 | SPUTTER CATHODE ASSEMBLY AND SPUTTER COATING DEVICE A magnetron cathode assembly of the present invention comprises a drive shaft, one end being connected with a cathode or target assembly in the interior space of a vacuum chamber. A housing is rigidly mounted to the wall of a coating chamber of a sputter coating device ... | 09/25/2008 |
| 20080227374 | POLISHING HEAD TESTING WITH MOVABLE PEDESTAL A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the... | 09/18/2008 |
| 20080227367 | Substrate polishing metrology using interference signals A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generat... | 09/18/2008 |
| 20080226271 | EVAPORATION CRUCIBLE AND EVAPORATION APPARATUS WITH ADAPTED EVAPORATION CHARACTERISTIC An evaporation crucible is described. The evaporation crucible (100; 300; 400; 500) includes: an electrically conductive body (120) and a cover (150; 550); the body having a first electrical connection (162) and a second electrical connection... | 09/18/2008 |
| 20080223725 | Process chamber component having electroplated yttrium containing coating A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment ... | 09/18/2008 |
| 20080223294 | Flooding Chamber For Coating Installations The invention relates to a flooding chamber for coating installations, with which shorter flooding times, and therewith shorter clock cycles, can be attained. Two flooding means are therein utilized, between which a substrate is disposed symmetrically. The flooding mean... | 09/18/2008 |
| 20080220261 | Temperable Glass Coating The invention relates to a silver low-E coating for glass which is temperable and can be applied by means of sputter processes onto the glass. The individual layers of the coating are cost-effective standard materials. One embodiment of the invention for example is comp... | 09/11/2008 |
