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"That’s an amazing invention, but who would ever want to use one of them?"
President Rutherford B. Hayes ; Said in 1876, after Alexander Graham Bell demonstrated the telephone to him at the White House
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| Application No. | Application Title | Issue Date |
| 20120126392 | Methods for Making Micro Needles and Applications Thereof The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method com... | 05/24/2012 |
| 20120019886 | VIA STRUCTURE AND METHOD THEREOF A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated con... | 01/26/2012 |
| 20120018852 | VIA STRUCTURE AND METHOD THEREOF A vent hole precursor structure (26) in an intermediate product for a semi-conductor device has delicate structures (27, 28), and said intermediate product has a cavity (21) with a pressure therein differing from the pressure of the surroundings. Th... | 01/26/2012 |
| 20100053922 | MICROPACKAGING METHOD AND DEVICES A method of micro-packaging a component wherein at least a first and a second semi-conductor substrate are provided, one of which has electrical through connections (vias). A depression in either one of the substrates or in both is etched. A component is provided above ... | 03/04/2010 |
| 20100052107 | VIAS AND METHOD OF MAKING The invention relates to a method of providing a planar substrate with electrical through connections (vias). The method comprises providing a hole in said substrate and a treatment to render the substrate surface exhibiting a lower wettability than the walls inside the... | 03/04/2010 |
| 20080308884 | Fabrication of Inlet and Outlet Connections for Microfluidic Chips A method of making a fluid communication channel between a micro mechanical structure provided on a front side of a device and the back side of said device is described. It includes making the required structural components by lithographic and etching processes on said ... | 12/18/2008 |
| 20060032039 | PRESSURE SENSOR In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming... | 02/16/2006 |
