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| Application No. | Application Title | Issue Date |
| 20110304214 | Switching Configuration and Method for the Production of an Alternating Voltage from at Least Supply Terminals with Temporally Variable Output DC Voltage A circuit having a plurality of parallel-connected partial circuits for feeding an inverter circuit. A partial circuit comprises an unregulated voltage source with a temporally variable output DC voltage and a synchronous converter having an automatically functioning re... | 12/15/2011 |
| 20090179309 | Power semiconductor component with trench- type second contact region A power semiconductor component and method for producing it. The component has a semiconductor base body with a first doping and a pn junction formed by a contact region having a second doping with a doping profile in the base body. The second contact region is arranged... | 07/16/2009 |
| 20090179224 | Power semiconductor component with trench-type field ring structure A power semiconductor component and a method for producing such a component. The component comprises a semiconductor base body having a first doping. A pn junction is formed in the base body by a contact region having a second doping with a first doping profile. A field... | 07/16/2009 |
| 20090134482 | Power semiconductor module having a substrate and a pressure device A power semiconductor module having a substrate, a housing and a pressure device. The substrate further includes a body formed of an insulating material and structured conductor tracks which are arranged thereon and have load and auxiliary potentials. The substrate also... | 05/28/2009 |
| 20090096083 | Connecting structure for connecting at least one semiconductor component to a power semiconductor module A connecting structure comprising a connecting device for electrically conductive connection to at least one semiconductor component and a filler. The connecting device is a film composite comprising at least two electrical films with an insulating film therebetween. Th... | 04/16/2009 |
| 20090045500 | Power semiconductor module with a connected substrate carrier and production method therefor A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout i... | 02/19/2009 |
| 20090039516 | Power semiconductor component with metal contact layer and production method therefor A power semiconductor component having a basic body and at least one contact area. At least one first thin metallic layer of a first material is arranged on the contact area. A second metallic layer—thicker than the first—of a second material is arranged on the firs... | 02/12/2009 |
| 20090039494 | Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the sub... | 02/12/2009 |
| 20090032931 | Power semiconductor module with connecting devices A power semiconductor module having a housing with first connecting devices for arrangement on an external cooling component, at least one substrate carrier with power-electronics circuit arrangements constructed thereon and electrical terminal elements extending theref... | 02/05/2009 |
| 20090032912 | Semiconductor component with buffer layer A semiconductor component having at least one pn junction and an associated production method. The semiconductor component has a layer sequence of a first zone having a first dopant. The first zone faces a first main area. Adjacent to the first zone are a second zone ha... | 02/05/2009 |
| 20090021922 | Housing for a power module A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power mo... | 01/22/2009 |
| 20090008784 | Power semiconductor substrates with metal contact layer and method of manufacture thereof A power semiconductor substrate comprising an insulating planar base, at least one conductor track and at least one contact area as part of the conductor track, wherein a layer of a metallic material is disposed on the contact area by means of pressure sintering. The as... | 01/08/2009 |
| 20080292874 | Sintered power semiconductor substrate and method of producing the substrate A power semiconductor substrate with an insulating sheet-like base, having at least one sequence of layers of: a thin adhesion promoting layer, a sintered metal layer and a conductive layer arranged on at least one main area of the substrate. The associated process incl... | 11/27/2008 |
| 20080266812 | Pressure-contact power semiconductor module and method for producing the same A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the ... | 10/30/2008 |
| 20080212302 | Housing for a power semiconductor module A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the hous... | 09/04/2008 |
| 20080203978 | Frequency converter for a double-fed asynchronous generator with variable power output and method for its operation A frequency converter circuit for a double-fed asynchronous generator with a variable power output, which can be connected to a voltage network contains a rotor rectifier, which can be connected to the rotor of the asynchronous generator, a network frequency converter, ... | 08/28/2008 |
| 20080136488 | Drive circuit with BOT level shifter for transmitting an input signal and assigned method A drive circuit in power electronic systems comprising a half-bridge circuit of two power switches, a first so-called TOP switch and a second so-called BOT switch, which are arranged in a series circuit. The drive circuit has a BOT level shifter for transmitting an inpu... | 06/12/2008 |
| 20080055951 | Power converter circuit and method for feeding a system from a DC voltage source Circuit and method for converting a DC voltage, which is not constant over time and is preferably from a solar energy installation, into an AC voltage. The circuit arrangement has an input inductor and an H-bridge having a respective first current valve and a respective... | 03/06/2008 |
| 20080023818 | Contact device for use in a power semiconductor module or in a disc-type thyristor A contact device for use with a power semiconductor component in a power semiconductor module or a disc-type thyristor, the module or thyristor having a molded body with a first recess disposed above the component. The contact device makes electrical contact with the au... | 01/31/2008 |
| 20080007918 | Power semiconductor module with connection elements electrically insulated from one another A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body w... | 01/10/2008 |
| 20080007277 | Method for measuring the insulation resistance in an IT network A method for measuring the insulation resistance in an IT network. The IT network has a DC voltage intermediate circuit and at least one self-commutated converter having at least one first and one second power switch. The IT network also includes a measuring arrangement... | 01/10/2008 |
| 20080007973 | Power converter circuit for a high-voltage direct voltage connection A power converter circuit for converting a multi-phase alternating voltage into a high-voltage direct voltage and then into a second multi-phase alternating voltage. The circuit comprises first and second cascades of power converter cells, each cascade having first term... | 01/10/2008 |
| 20070272976 | Power semiconductor module A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor tracks are disposed inside the substrate, facing the circuit board, for rece... | 11/29/2007 |
| 20070227767 | Connecting device for eletronic components A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides ... | 10/04/2007 |
| 20070222060 | Compact power semiconductor module having a connecting device A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which... | 09/27/2007 |
| 20070194429 | Pressure contact power semiconductor module A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion and having a plurality of contact feet extending from the flat portion. ... | 08/23/2007 |
| 20070194443 | Power semiconductor modules having a cooling component and method for producing them An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at the ... | 08/23/2007 |
| 20070187817 | Power semiconductor modules and method for producing them A power semiconductor module in a pressure contact embodiment and a method for producing such modules, for disposition on a cooling component. Load terminals of the modules are formed as metal molded bodies having at least one contact element, one flat portion, and cont... | 08/16/2007 |
| 20070131353 | Apparatus and clocked method for pressure-sintered bonding An apparatus and a clocked method for pressure-sintered bonding of a plurality of chiplike components to conductor tracks on a substrate. The apparatus has a pressing device, a conveyor belt, and a further device for covering the substrate with a protective film. The pr... | 06/14/2007 |
| 20070117421 | Power semicondutor module with capacitors connected parallel to one another A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module fu... | 05/24/2007 |
| 20070105275 | Apparatus for positioning power semiconductor modules and method for surface treatment thereof An apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a molded positioning body. The molded positioning body has a planar first main face and a plurality of receptacles for receiving the power s... | 05/10/2007 |
| 20070104926 | Circuit device in particular frequency converter A frequency converter is presented. The frequency converter includes a circuit module, which is interconnected to a circuit board and is connected to a heat sink. For attaining a frequency converter in a modular version with optimal cooling properties, the circuit modul... | 05/10/2007 |
| 20070102796 | Power semiconductor module A power semiconductor module is presented. The power semiconductor module has a substrate, a composite film, and a power semiconductor component between the substrate and the composite film. The composite film has a thin circuit-structured logic metal layer and a thick ... | 05/10/2007 |
| 20070102489 | Ultrasonic welding head An ultrasonic welding head for ultrasonic welding connection of a chip to a substrate is described, in which the welding parameters have a negligibly slight variation or are constant. This is attained by providing that a static friction element that increases the static... | 05/10/2007 |
| 20070085181 | Power semiconductor module with overcurrent protective device A power semiconductor module having at least one fuse. The power semiconductor module comprises a housing, load terminal elements that lead outside of the housing, and a substrate disposed inside the housing with a plurality of metal connecting tracks of different polar... | 04/19/2007 |
