Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20120127049 | FREQUENCY STABILIZATION CIRCUIT, FREQUENCY STABILIZATION DEVICE, ANTENNA APPARATUS AND COMMUNICATION TERMINAL EQUIPMENT, AND IMPEDANCE CONVERSION ELEMENT A frequency stabilization device includes a first radiating element, a second radiating element, a feeding circuit connected to the first and second radiating elements, and a frequency stabilization circuit disposed between the feeding circuit and the first radiating el... | 05/24/2012 |
| 20120126365 | Anti-Fuse Element An anti-fuse element that includes an insulation layer; a pair of electrode layers formed on upper and lower surfaces of the insulation layer; and an extraction electrode contacting a section of the electrode layers forming electrostatic capacitance with the insulation ... | 05/24/2012 |
| 20120125675 | ELECTRONIC COMPONENT An electronic component that can be mounted with good balance includes a substrate, a plurality of first terminals located on a peripheral portion of one main surface of the substrate, a ground electrode located in a center of the one main surface of the substrate and i... | 05/24/2012 |
| 20120107696 | SECONDARY BATTERY An electrode active material mainly includes an organic compound having, in a structural unit thereof, a conjugated diamine structure represented by the general formula (I), and an electrolyte includes a carbonate ester compound represented by the general formula (II). ... | 05/03/2012 |
| 20120104897 | SURFACE ACOUSTIC WAVE DEVICE A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode d... | 05/03/2012 |
| 20120083219 | MULTI-RADIO TEST METHOD AND TEST FIXTURE A method for testing characteristics of a communication device that includes a plurality of modules using a test fixture includes the steps of connecting the communication device to the test fixture, determining if tests to be performed on the plurality of modules can b... | 04/05/2012 |
| 20120081927 | ISOLATED SWITCHING POWER SUPPLY APPARATUS An isolated switching power supply apparatus includes a direct-current input power supply, a power transmission transformer including a primary winding and a secondary winding, at least one main switching element configured to perform switching control on a direct-curre... | 04/05/2012 |
| 20120081836 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR A laminated ceramic capacitor which exhibits excellent lifetime characteristics in a high temperature loading test uses a dielectric ceramic constituting the dielectric layers which contains (Ba1-xCax)TiO3 as its main constituent, and co... | 04/05/2012 |
| 20120081206 | SEMICONDUCTOR CERAMIC AND POSITIVE-COEFFICIENT CHARACTERISTIC THERMISTOR A semiconductor ceramic and a positive-coefficient characteristic thermistor are provided which have a stable PTC characteristic, a high double point, and a wide operating temperature range. The semiconductor ceramic contains, as a main component, a barium titanate-base... | 04/05/2012 |
| 20120081192 | BRANCHING DEVICE In a branching device, an LPF includes a first inductor arranged such that some conductor layers from among conductor layers are wound in a clockwise direction, and a second inductor arranged such that a conductor layer from among the conductor layers is wound in an cou... | 04/05/2012 |
| 20120069489 | ELECTRONIC COMPONENT In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors ar... | 03/22/2012 |
| 20120068788 | ELASTIC WAVE APPARATUS AND DUPLEXER An elastic wave apparatus includes a balanced-unbalanced transforming function, and an elastic wave filter and a multilayer wiring board on which the elastic wave filter is mounted. The elastic wave filter includes an unbalanced terminal and first and second balanced te... | 03/22/2012 |
| 20120068787 | ELASTIC WAVE RESONATOR, LADDER FILTER AND DUPLEXER An acoustic wave resonator that is excellent in terms of return loss characteristics at the resonant and anti-resonant frequencies and that is capable of effectively reducing loss includes an IDT electrode in which a plurality of first electrode fingers and a plurality ... | 03/22/2012 |
| 20120068127 | BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC COMPOSITION AND BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC DEVICE A barium titanate-based semiconductor ceramic composition which can be used for PTC thermistors for temperature sensors and which has characteristics, including a linear characteristic, advantageous for such PTC thermistors and a barium titanate-based semiconductor cera... | 03/22/2012 |
| 20120049974 | ELECTRONIC COMPONENT External electrodes are provided on a bottom surface of a laminate, and are connected to both ends of a main line and both ends of a sub-line, respectively. A warpage prevention conductor is provided on an insulating material layer that is provided on a top surface side... | 03/01/2012 |
| 20120049945 | HIGH-FREQUENCY MODULE A high-frequency switch module includes a FET switch mounted on a multilayer substrate and a low pass filter arranged between the FET switch and a transmission signal input terminal. The low pass filter includes at least one inductor connected in series between a transm... | 03/01/2012 |
| 20120049691 | MANUFACTURING METHOD FOR BOUNDARY ACOUSTIC WAVE DEVICE AND BOUNDARY ACOUSTIC WAVE DEVICE A manufacturing method for a boundary acoustic wave device is capable of certainly providing the boundary acoustic wave device with desired target frequency characteristics. The manufacturing method for the boundary acoustic wave device includes a process for preparing ... | 03/01/2012 |
| 20120043854 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electr... | 02/23/2012 |
| 20120043129 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrode... | 02/23/2012 |
| 20120043117 | SIGNAL TRANSMISSION LINE AND CIRCUIT BOARD A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direct... | 02/23/2012 |
| 20120039015 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component ma... | 02/16/2012 |
| 20120039014 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the compo... | 02/16/2012 |
| 20120038435 | ELASTIC WAVE APPARATUS In an elastic wave apparatus, a first dielectric layer is laminated on a piezoelectric substrate. An electrode structure is provided at an interface between the first dielectric layer and the piezoelectric substrate. The electrode structure includes a first electrode st... | 02/16/2012 |
| 20120033455 | SWITCHING POWER SUPPLY APPARATUS In a switching power supply apparatus, a comparator outputs a first determination criterion signal based on a saw-tooth wave signal whose level fluctuates with a constant period and a detection voltage signal. An inverter subjects the first determination criterion signa... | 02/09/2012 |
| 20120033454 | SWITCHING POWER SUPPLY APPARATUS A resonance-type power supply is provided in which no short circuit occurs and driving is performed with a constant switching period by performing switching control using a change of magnetic flux of a magnetic component as a trigger. When the change of magnetic flux of... | 02/09/2012 |
| 20120032758 | ELECTRONIC COMPONENT In an electronic component, a first LC resonant circuit includes a first coil including coil portions that extend from a first external electrode to a second external electrode while turning in a first direction. A second LC resonant circuit includes a second coil inclu... | 02/09/2012 |
| 20120025931 | BOUNDARY ACOUSTIC WAVE RESONATOR AND LADDER FILTER In a boundary acoustic wave resonator, apodization weighting is performed on an IDT electrode so that an intersecting width decreases as a location moves outward in a boundary acoustic wave propagation direction. An inner side of a first busbar includes inclined portion... | 02/02/2012 |
| 20120025333 | MEMS ELEMENT AND METHOD FOR MANUFACTURING SAME An acceleration sensor is formed using an etched layer sandwiched between first and second substrates. In this case, a structure including a movable portion which is displaceable in the thickness direction of the substrates, and a support frame are formed in the etched ... | 02/02/2012 |
| 20110281540 | ANTENNA COMBINING MODULE In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a dupl... | 11/17/2011 |
| 20120021551 | THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, pa... | 01/26/2012 |
| 20110280239 | COMMUNICATION SESSION HAND-OFF METHOD AND COMMUNICATION DEVICE A communication session hand-off method of a communication device includes establishing a first communication session over a first network between a first communication interface of the communication device and a communication interface of another communication device, ... | 11/17/2011 |
| 20110279945 | ESD PROTECTION DEVICE An ESD protection device includes a ceramic multilayer substrate including a plurality of laminated insulating layers, an external electrode, at least one of an in-plane connecting conductor and an interlayer connecting conductor, and a mixture portion. The mixture port... | 11/17/2011 |
| 20110279340 | ANTENNA AND WIRELESS IC DEVICE An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the c... | 11/17/2011 |
| 20110279326 | WIRELESS IC DEVICE A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pa... | 11/17/2011 |
| 20110279194 | DUPLEXER MODULE In a duplexer module, a transmitting signal is correctly monitored without deteriorating receiving sensitivity. The duplexer module includes a transmission line, a reception line, and an antenna common line, and performs conversion between a transmission signal and a re... | 11/17/2011 |
| 20110279193 | DUPLEXER MODULE A duplexer module that prevents degradation of isolation between signal lines includes transmission filters, reception filters, phase adjusting circuits, and a multilayer substrate. The transmission filters and the reception filters are constituted as separate discrete ... | 11/17/2011 |
| 20110279177 | DUPLEXER MODULE A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurali... | 11/17/2011 |
| 20110278993 | METHOD FOR MANUFACTURING COMPOSITE PIEZOELECTRIC SUBSTRATE AND PIEZOELECTRIC DEVICE A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on t... | 11/17/2011 |
| 20120019982 | ELECTRONIC COMPONENT An electronic component includes a ceramic body including first to fourth side surfaces, a first external electrode provided on one side surface of the ceramic body, a second external electrode, and a plurality of reinforcing electrodes. Each of the first and second ext... | 01/26/2012 |
| 20120019981 | CERAMIC ELECTRONIC COMPONENT A ceramic electronic component includes a first reinforcement layer. The first reinforcement layer is arranged in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer face a first porti... | 01/26/2012 |