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| Application No. | Application Title | Issue Date |
| 20120126805 | Current Sensor Embodiments of the invention provide a current sensor including a conductive element and at least two magnetic field sensors. The conductive element includes at least three terminal areas and a common conductive area, wherein each of the at least three terminal areas is... | 05/24/2012 |
| 20120126783 | SELF TIMED CURRENT INTEGRATING SCHEME EMPLOYING LEVEL AND SLOPE DETECTION Some embodiments of the invention relate to a sense amplifier configured to determine the slope of a bitline charging voltage and to utilize the determined slope in combination with a voltage level sensing scheme to aid in reading data from a memory cell associated with... | 05/24/2012 |
| 20120126344 | SENSOR DEVICE AND METHOD A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semicondu... | 05/24/2012 |
| 20120126343 | Self Aligned Silicided Contacts Structures and methods of forming self aligned silicided contacts are disclosed. The structure includes a gate electrode disposed over an active area, a liner disposed over the gate electrode and at least a portion of the active area, an insulating layer disposed over t... | 05/24/2012 |
| 20120126318 | Integrated Circuit Including Field Effect Transistor An integrated circuit includes a semiconductor carrier including a first side and a second side opposite the first side. An FET is in a first area of the semiconductor carrier, and has a drain electrically coupled to a drain contact area at the first side and a source e... | 05/24/2012 |
| 20120110374 | Methods and Systems for Measuring I/O Signals Some embodiments of the invention relate to an embedded processing system. The system includes a memory unit to store a plurality of operating instructions and a processing unit coupled to the memory unit. The processing unit can execute logical operations corresponding... | 05/03/2012 |
| 20120106086 | SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AN INSERT A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the... | 05/03/2012 |
| 20120105173 | MEMS Device System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure fixed to the first anchor region, a first electrode adjacent the vibrating MEMS structure, a second electrode ad... | 05/03/2012 |
| 20120104592 | SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropicall... | 05/03/2012 |
| 20120104582 | High Power Ceramic on Copper Package According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the... | 05/03/2012 |
| 20120104574 | INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. I... | 05/03/2012 |
| 20120104537 | Semiconductor Device and a Method for Manufacturing a Semiconductor Device A semiconductor device and a method for forming a semiconductor device are provided. The semiconductor device includes a semiconductor body with a first semiconductor region and a second semiconductor region spaced apart from each other. A first metallization is in cont... | 05/03/2012 |
| 20120084512 | FAST UNALIGNED CACHE ACCESS SYSTEM AND METHOD A cache unit multiple memory towers, which can be independently addressed. Cache lines are divided among multiple towers. Furthermore, physical lines of the memory towers are shared by multiple cache lines. Because each tower can be addressed independently and the cache... | 04/05/2012 |
| 20120083236 | Multimode Receiver with Active Blocker Suppression Various embodiments of a wireless multimode receiver having an off-chip duplex filter associated with a multimode band, and a blocker cancellation circuit disposed on a semiconductor chip are described in the present disclosure.... | 04/05/2012 |
| 20120083098 | Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.... | 04/05/2012 |
| 20120082099 | RADIO BASE STATIONS, MOBILE RADIO TERMINALS, METHODS FOR CONTROLLING A RADIO BASE STATION, AND METHODS FOR CONTROLLING A MOBILE RADIO TERMINAL In an embodiment, a radio base station is provided. The radio base station may include: a receiver configured to receive, via a pre-determined radio resource, a Random Access Preamble from a mobile radio terminal; a load determiner configured to determine whether a load... | 04/05/2012 |
| 20120081166 | Level Shifter Circuits and Methods Some embodiments of the present disclosure relate to a level shifter that provides improved response time and/or low static power dissipation compared to conventional level shifters. In some embodiments, a level shifter circuit includes an input terminal coupled to a fi... | 04/05/2012 |
| 20120081109 | Hall sensor arrangement for the redundant measurement of a magnetic field In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first semiconductor substrate; a second Hall sensor on a top side of a second semiconductor substrate; a carrier having... | 04/05/2012 |
| 20120080799 | Semiconductor Module Comprising an Insert and Method for Producing a Semiconductor Module Comprising an Insert A power semiconductor module is fabricated by providing a base with a metal surface and an insulating substrate comprising an insulation carrier having a bottom side provided with a bottom metallization layer. An insert exhibiting a wavy structure is provided. The inser... | 04/05/2012 |
| 20120072504 | DEVICES AND METHODS FOR MANAGING COLLABORATIVE COMMUNICATIONS SESSIONS In an embodiment, a method for providing information for managing a collaborative communications session may be provided. The method may include generating a first message according to a call control protocol; generating a second message according to the call control pr... | 03/22/2012 |
| 20120072503 | METHODS AND DEVICES FOR AUTHORIZATION IN COLLABORATIVE COMMUNICATIONS SESSIONS In an embodiment, a method for changing a collaborative communications session may be provided. The method may include: sending a request message requesting for authorizing a change of a collaborative communications session to an end device of the collaborative communic... | 03/22/2012 |
| 20120071200 | METHOD AND DEVICE FOR SELECTING A SERVING BASE STATION, MOBILE COMMUNICATION NETWORK, BASE STATION, AND METHOD FOR DETERMINING TRANSMISSION CHARACTERISTICS According to one embodiment, a device for selecting a serving base station of a plurality of base stations of a mobile communication system is described which comprises a receiving circuit configured to receive, for each base station of the plurality of base stations, a... | 03/22/2012 |
| 20120071190 | BASE STATIONS AND RADIO DEVICES According to an embodiment, a base station operates a first radio cell of a mobile communication network and signals, for a mobile terminal in the first radio cell having a communication connection via the base station, to a first radio device of a plurality of radio de... | 03/22/2012 |
| 20120071120 | Adaptive Adjustment of Active Area for Power Amplifier One embodiment of the present invention relates to a transmission circuit configured to dynamically adjust a number of active transistor cells within a power amplifier based upon a signal quality measurement determined from a feedback. The transmission circuit comprises... | 03/22/2012 |
| 20120070977 | Methods For Forming Contacts in Semiconductor Devices Mask sets, layout design, and methods for forming contacts in devices are described. In one embodiment, a semiconductor device includes a plurality of contacts disposed over a substrate, the plurality of contacts being disposed as rows and columns on an orthogonal grid,... | 03/22/2012 |
| 20120070941 | MODULE WITH SILICON-BASED LAYER The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is arranged on the side of the carrier element opposite to the semiconductor dev... | 03/22/2012 |
| 20120069673 | METHOD AND DEVICE FOR PROGRAMMING DATA INTO NON-VOLATILE MEMORIES A device includes a non-volatile memory and a control unit, wherein the control unit is configured to change over programming of data of the non-volatile memory from a first programming mode to a second, different programming mode based on the occurrence of a control si... | 03/22/2012 |
| 20120069311 | Passivation of Multi-Layer Mirror for Extreme Ultraviolet Lithography A reflector structure suitable for extreme ultraviolet lithography (EUVL) is provided. The structure comprises a substrate having a multi-layer reflector. A capping layer is formed over the multi-layer reflector to prevent oxidation. In an embodiment, the capping layer ... | 03/22/2012 |
| 20120068345 | LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS In various embodiments, a layer stack is provided. The layer stack may include a carrier; a first metal disposed over the carrier; a second metal disposed over the first metal; and a solder material disposed above the second metal or a material that provides contact to ... | 03/22/2012 |
| 20120068323 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carr... | 03/22/2012 |
| 20120052823 | DC Power Control for Power Amplifiers Some embodiments of the present disclosure relate to transmission techniques that result in power savings relative to previous solutions. These techniques often transmit a signal-of-interest by using two paths, namely, a transmission path (which includes a power amplifi... | 03/01/2012 |
| 20120052798 | Transponder Power Supply, a Transponder and a Method for Providing a Transponder Power Supply Current A transponder power supply for providing a supply current based on an antenna input signal. The transponder power supply comprises an emergency circuit comprising a charging circuit, an emergency capacitor, and an output stage. The charging circuit is configured to char... | 03/01/2012 |
| 20120049907 | CIRCUIT WITH NOISE SHAPER In an embodiment, a circuit comprising an oscillator is provided. The oscillator is controlled based on a feedback value and an input reference value. The feedback value or the reference value or both are generated using noise shaping.... | 03/01/2012 |
| 20120049884 | Crack Sensors for Semiconductor Devices Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are disclosed. In one embodiment, a crack sensor includes a conductive structure disposed proximate a perimeter o... | 03/01/2012 |
| 20120049373 | Integrated Circuit Including Interconnect Levels An integrated circuit as described herein includes an upper interconnect level including a continuous upper interconnect area, the continuous upper interconnect area including a plurality of upper contact openings. The integrated circuit further includes a lower interco... | 03/01/2012 |
| 20120044102 | TIME-TO-DIGITAL CONVERTER WITH BUILT-IN SELF TEST Apparatuses and methods related to time-to-digital converters (TDCs) are herein described. Generally, a time-to-digital converter is a device which measures a time period or time interval and outputs a digital value representing the measured time period. In an implement... | 02/23/2012 |
| 20120042296 | Asymmetric Segmented Channel Transistors Structures, layouts and methods of forming integrated circuits are described. In various embodiments, the current invention includes an asymmetric segmented transistor. The asymmetric segmented transistor includes a source region and a drain region disposed within an ac... | 02/16/2012 |
| 20120040628 | Transceiver with Interferer Control Some embodiments of the present disclosure relate to a transceiver that includes multiple communication subunits associated with multiple communication protocols, respectively. The transceiver includes a conflict detection and control unit that determines whether interf... | 02/16/2012 |
| 20120038063 | REPAIRABLE SEMICONDUCTOR DEVICE AND METHOD Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is remove... | 02/16/2012 |
| 20120036483 | DEVICE, METHOD FOR DISPLAYING A CHANGE FROM A FIRST PICTURE TO A SECOND PICTURE ON A DISPLAY, AND COMPUTER PROGRAM PRODUCT A device is described having a memory storing data specifying a change animation between pictures to be displayed successively on the display, a setting circuit configured to store a setting specifying that a change animation between pictures to be displayed successivel... | 02/09/2012 |
