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| Application No. | Application Title | Issue Date |
| 20110214910 | WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, whic... | 09/08/2011 |
| 20110193583 | METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of... | 08/11/2011 |
| 20110189564 | FUEL CELL USING CARBON NANOTUBES A fuel cell comprises an anode, a cathode, and a proton exchange membrane. The anode and cathode can include a catalyst layer which includes a plurality of generally aligned carbon nanotubes. Methods of making a fuel cell are also disclosed.... | 08/04/2011 |
| 20110169516 | PROBE ELEMENT HAVING A SUBSTANTIALLY ZERO STIFFNESS AND APPLICATIONS THEREOF A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement ra... | 07/14/2011 |
| 20110156735 | WAFER TEST CASSETTE SYSTEM Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can cons... | 06/30/2011 |
| 20110156734 | TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a pred... | 06/30/2011 |
| 20110115512 | Integrated circuit tester with high bandwidth probe assembly Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjustin... | 05/19/2011 |
| 20110067231 | ATTACHMENT OF AN ELECTRICAL ELEMENT TO AN ELECTRONIC DEVICE USING A CONDUCTIVE MATERIAL An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conducti... | 03/24/2011 |
| 20110057018 | METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire ste... | 03/10/2011 |
| 20110043240 | METHOD AND APPARATUS FOR PROVIDING ACTIVE COMPLIANCE IN A PROBE CARD ASSEMBLY A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the fir... | 02/24/2011 |
| 20110043233 | WAFER LEVEL CONTACTOR A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from elec... | 02/24/2011 |
| 20110025361 | HIGH PERFORMANCE PROBE SYSTEM A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The p... | 02/03/2011 |
| 20100323551 | SHARPENED, ORIENTED CONTACT TIP STRUCTURES An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surf... | 12/23/2010 |
| 20100315111 | SINGLE SUPPORT STRUCTURE PROBE GROUP WITH STAGGERED MOUNTING PATTERN A probe group can include multiple probes for testing devices having contact pads. The probes can comprise beams, contact tip structures, and mounting portions. The beams can provide for controlled deflection of the probes. The contact tip structures can be connected to... | 12/16/2010 |
| 20100297863 | ELECTRICAL CONTACTOR, ESPECIALLY WAFER LEVEL CONTACTOR, USING FLUID PRESSURE An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to... | 11/25/2010 |
| 20100264949 | FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are removed. The flexure band can hold one or more temperature control devices... | 10/21/2010 |
| 20100264947 | CLOSED-GRID BUS ARCHITECTURE FOR WAFER INTERCONNECT STRUCTURE An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure ... | 10/21/2010 |
| 20100263432 | METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of... | 10/21/2010 |
| 20100253375 | ANCHORING CARBON NANOTUBE COLUMNS A technique for anchoring carbon nanotube columns to a substrate can include use of a filler material placed onto the surface of the substrate into area between the columns and surrounding a base portion of each of the columns.... | 10/07/2010 |
| 20100252317 | CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferre... | 10/07/2010 |
| 20100244873 | APPARATUS AND METHOD OF TESTING SINGULATED DIES An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow i... | 09/30/2010 |
| 20100225344 | PROBING APPARATUS WITH GUARDED SIGNAL TRACES A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on ... | 09/09/2010 |
| 20100224303 | METHOD TO BUILD ROBUST MECHANICAL STRUCTURES ON SUBSTRATE SURFACES A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated found... | 09/09/2010 |
| 20100154861 | PRINTED SOLAR PANEL A solar panel can include a substrate with layers of droplets of different materials disposed on a surface of the substrate. An outer layer can be disposed away from the surface and can comprise a face of the solar panel. The layers can comprise a cathode electrode and ... | 06/24/2010 |
| 20100134129 | MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame b... | 06/03/2010 |
| 20100134128 | Thermocentric Alignment Of Elements On Parts Of An Apparatus A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted int... | 06/03/2010 |
| 20100134127 | MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame b... | 06/03/2010 |
| 20100120267 | WAFER LEVEL INTERPOSER Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on ... | 05/13/2010 |
| 20100112828 | CARBON NANOTUBE CONTACT STRUCTURES A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate ... | 05/06/2010 |
| 20100109688 | PRINTING OF REDISTRIBUTION TRACES ON ELECTRONIC COMPONENT A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribut... | 05/06/2010 |
| 20100104678 | APPARATUS AND METHOD FOR MAKING AND USING A TOOLING DIE A method of making a tooling die can include depositing a plurality of layers onto a substrate using a printing process. Selected portions of the plurality of layers can be removed to expose a surface defining a desired shape of the tooling die. An electrically conducti... | 04/29/2010 |
| 20100093229 | MICROELECTRONIC CONTACT STRUCTURE AND METHOD OF MAKING SAME Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial s... | 04/15/2010 |
| 20100088888 | LITHOGRAPHIC CONTACT ELEMENTS A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a fir... | 04/15/2010 |
| 20100083489 | CARBON NANOTUBE COLUMNS AND METHODS OF MAKING AND USING CARBON NANOTUBE COLUMNS AS PROBES Carbon nanotube columns each comprising carbon nanotubes can be utilized as electrically conductive contact probes. The columns can be grown, and parameters of a process for growing the columns can be varied while the columns grow to vary mechanical characteristics of t... | 04/08/2010 |
| 20100078206 | Process of Positioning Groups of Contact Structures A contact apparatus can be made by providing a first substrate with electrically conductive terminals and second substrates each of which can have contact structures. Each of the contact structures can have a contact tip. The second substrates can be aligned such that c... | 04/01/2010 |
| 20100066397 | ALIGNMENT FEATURES IN A PROBING DEVICE An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For example, ... | 03/18/2010 |
| 20100065963 | METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor w... | 03/18/2010 |
| 20100052714 | PROBE CARD COOLING ASSEMBLY WITH DIRECT COOLING OF ACTIVE ELECTRONIC COMPONENTS A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high... | 03/04/2010 |
| 20100049356 | REMOTE TEST FACILITY WITH WIRELESS INTERFACE TO LOCAL TEST FACILITIES A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which a... | 02/25/2010 |
| 20100045407 | ELECTROMAGNETICALLY COUPLED INTERCONNECT SYSTEM ARCHITECTURE An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly ... | 02/25/2010 |
