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Assignee: Evigia Systems, Inc.


Location: Ann Arbor, MI
No. of applications: 3

Application No.Application TitleIssue Date
20080188059INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR
A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to defin...
08/07/2008
20080053229THREE-AXIS INERTIAL SENSOR AND METHOD OF FORMING
A three-axis inertial sensor and a process for its fabrication using an silicon-on-oxide (SOI) wafer as a starting material. The SOI wafer has a first conductive layer separated from a second conductive layer by an insulative buried oxide (BOX) layer. The SOI wafer is f...
03/06/2008
20070024410METHOD AND SYSTEM FOR MONITORING ENVIRONMENTAL CONDITIONS
A sensing system, sensing method, and method of producing a sensing system capable of providing a cumulative measurement capability, such as in the form of a RFID tag capable of measuring cumulative heat and humidity for continuous monitoring of storage and shipping con...
02/01/2007
 
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