Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Application No. | Application Title | Issue Date |
| 20130119872 | SOLID STATE LIGHTING SWITCHES AND FIXTURES PROVIDING SELECTIVELY LINKED DIMMING AND COLOR CONTROL AND METHODS OF OPERATING A solid state lighting switch can include a first input control that can be configured to adjust a dimming indication or color indication for a solid state lighting fixture that is configured for coupling to the solid state lighting switch. A selective linking mechanism... | 05/16/2013 |
| 20130119418 | METHODS OF FORMING OPTICAL CONVERSION MATERIAL CAPS AND LIGHT EMITTING DEVICES INCLUDING PRE-FORMED OPTICAL CONVERSION MATERIAL CAPS A method of forming can be provided by applying an optical conversion material to a mold to form a unitary layer of optical conversion material and removing the unitary layer of optical conversion material from the mold.... | 05/16/2013 |
| 20130113358 | LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element ... | 05/09/2013 |
| 20130069547 | SOLID-STATE LIGHTING APPARATUS AND METHODS USING ENERGY STORAGE Some embodiments provide a lighting apparatus including a plurality of lighting circuits coupled in series. Each lighting circuit includes a control circuit configured to selectively provide current to at least one LED and at least one charge storage device coupled to t... | 03/21/2013 |
| 20130069536 | SOLID-STATE LIGHTING APPARATUS AND METHODS USING CURRENT DIVERSION CONTROLLED BY LIGHTING DEVICE BIAS STATES A lighting apparatus includes a string of light emitting diode (LED) sets coupled in series, each set including at least one LED. The apparatus further includes a plurality of current diversion circuits, respective ones of which are coupled to respective nodes of the st... | 03/21/2013 |
| 20130069535 | SOLID-STATE LIGHTING APPARATUS AND METHODS USING ENERGY STORAGE An apparatus includes a current control circuit configured to selectively provide current responsive to a varying voltage to at least one LED coupled in series with the first current control circuit and to at least one capacitor coupled to the at least one LED and the f... | 03/21/2013 |
| 20130058082 | LINEAR LIGHT EMITTING DEVICE ASSEMBLIES INCLUDING CYLINDRICALLY SHAPED DIFFUSERS A light emitting device assembly can include a plurality of substrates, extending in a longitudinal direction, that are coupled together to provide a plurality of surfaces that face in respective radial directions that are orthogonal to the longitudinal direction. A hea... | 03/07/2013 |
| 20130049021 | WHITE LEDS WITH EMISSION WAVELENGTH CORRECTION Methods for fabricating semiconductor devices such as LED chips with emission wavelength correction and devices fabricated using these methods. Different embodiments include sequential coating methods that provide two or more coatings or layers of conversion material ov... | 02/28/2013 |
| 20130026923 | SOLID STATE LIGHTING APPARATUS AND METHODS OF FORMING A solid state lighting apparatus can include a substrate having first and second opposing surfaces, where at least one of the opposing surfaces is configured to mount devices thereon. A string of chip-on-board light emitting diode (LED) sets, can be on the first surface... | 01/31/2013 |
| 20130021792 | MODULAR INDIRECT SUSPENDED/CEILING MOUNT FIXTURE A modular troffer-style fixture particularly well-suited for use with solid state light sources. The fixture comprises a reflector that includes parallel rails running along its length, providing a mount mechanism and structural support. An exposed heat sink is disposed... | 01/24/2013 |
| 20130009221 | SEMICONDUCTOR DEVICES INCLUDING EPITAXIAL LAYERS AND RELATED METHODS A semiconductor device may include a semiconductor layer having a first conductivity type, a well region of a second conductivity type in the semiconductor layer wherein the first and second conductivity types are different, and a terminal region of the first conductivi... | 01/10/2013 |
| 20130009179 | COMPACT OPTICALLY EFFICIENT SOLID STATE LIGHT SOURCE WITH INTEGRATED THERMAL MANAGEMENT A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of... | 01/10/2013 |
| 20130003363 | REVERSE TOTAL INTERNAL REFLECTION FEATURES IN LINEAR PROFILE FOR LIGHTING APPLICATIONS An elongated lens profile having reverse total internal reflection (TIR) features that improve light extraction when the lens is used in conjunction with a plurality of light emitters. Solid state light emitters, such as LEDs, are arranged proximate to the elongated len... | 01/03/2013 |
| 20130003346 | COMPACT HIGH EFFICIENCY REMOTE LED MODULE Solid state modules and fixtures comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, thermally conductive connection adapters allowing dissipation of heat outside of the module, and a remote power supply uni... | 01/03/2013 |
| 20120328299 | APPARATUS AND METHODS FOR OPTICAL CONTROL OF LIGHTING DEVICES A lighting apparatus includes at least one light emitting device configured to receive an optical signal from a source external to the lighting apparatus and a control circuit coupled to the at least one light emitting device and configured to adjust a light output of t... | 12/27/2012 |
| 20120326159 | LED STRUCTURE WITH ENHANCED MIRROR REFLECTIVITY Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an... | 12/27/2012 |
| 20120319148 | CONFORMAL GEL LAYERS FOR LIGHT EMITTING DIODES AND METHODS OF FABRICATING SAME Light emitting devices include a light emitting diode die on a mounting substrate and a conformal gel layer on the mounting substrate and/or on the light emitting diode die. The conformal gel layer may at least partially fill a gap between the light emitting diode die a... | 12/20/2012 |
| 20120319142 | GEL UNDERFILL LAYERS FOR LIGHT EMITTING DIODES AND METHODS OF FABRICATING SAME A light emitting device is fabricated by providing a mounting substrate and an array of light emitting diode dies adjacent the mounting substrate to define gaps. A gel that is diluted in a solvent is applied on the substrate and on the array of light emitting dies. At l... | 12/20/2012 |
| 20120306375 | SYSTEMS AND METHODS FOR CONTROLLING SOLID STATE LIGHTING DEVICES AND LIGHTING APPARATUS INCORPORATING SUCH SYSTEMS AND/OR METHODS A lighting apparatus includes at least two sets of light-emitting devices with overlapping spectra and different chromaticities, such as two sets of blue-shifted yellow (BSY) LEDs producing outputs with different yellow content. The devices may be selectively controlled... | 12/06/2012 |
| 20120305939 | LIGHT EMITTING DIODES INCLUDING BARRIER SUBLAYERS Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on ... | 12/06/2012 |
| 20120298955 | GROUP III NITRIDE BASED LIGHT EMITTING DIODE STRUCTURES WITH A QUANTUM WELL AND SUPERLATTICE, GROUP III NITRIDE BASED QUANTUM WELL STRUCTURES AND GROUP III NITRIDE BASED SUPERLATTICE STRUCTURES A semiconductor device is provided that includes a Group III nitride based superlattice and a Group III nitride based active region comprising at least one quantum well structure on the superlattice. The quantum well structure includes a well support layer comprising a ... | 11/29/2012 |
| 20120280263 | COMPOSITE HIGH REFLECTIVITY LAYER A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED or package to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises a LED and a composite high reflectivity layer integral to the LE... | 11/08/2012 |
| 20120280256 | REMOTE PHOSPHOR LIGHT EMITTING DEVICES, COMPONENTS AND FABRICATION A substrate including phosphor is remotely illuminated by an LED. Optical radiation that emerges through the substrate is measured. Portions of the substrate, such as raised features on the substrate, are then selectively removed responsive to the measuring, so as to ob... | 11/08/2012 |
| 20120275147 | Apparatus and Methods for Selecting Light Emitters Provided are devices and methods for grouping light emitters and devices including the same. Embodiments of such methods may include selecting a portion of the light emitters using a region of a multiple axis color space that is configured to represent each of a plurali... | 11/01/2012 |
| 20120256211 | METHODS OF FABRICATING LIGHT EMITTING DEVICES INCLUDING MULTIPLE SEQUENCED LUMINOPHORIC LAYERS, AND DEVICES SO FABRICATED An LED includes a first pedestal and may be fabricated by coating a first phosphor layer on the LED, thinning the first phosphor layer to expose the first pedestal, forming a second pedestal on the first pedestal, coating a second phosphor layer and thinning the second ... | 10/11/2012 |
| 20120256200 | HIGH EFFICIENCY LEDS A light emitting device and method of fabricating the same is disclosed that comprises at least one light emitter comprising an active region which emits light. The device further comprising a submount arranged such that the at least one light emitter is mounted to the ... | 10/11/2012 |
| 20120243222 | HOT LIGHT EMITTING DIODE (LED) LIGHTING SYSTEMS LED lighting systems operate their LED above a junction temperature of 85° C. and space apart from the LED, components of the LED lighting system that reduce an expected lifetime of the LED lighting system to less than 25,000 hours as a result of operating the LED abov... | 09/27/2012 |
| 20120241781 | SOLID STATE LIGHTING COMPONENT An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the... | 09/27/2012 |
| 20120235190 | ENCAPSULANT WITH INDEX MATCHED THIXOTROPIC AGENT Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emis... | 09/20/2012 |
| 20120228675 | HIGH TEMPERATURE PERFORMANCE CAPABLE GALLIUM NITRIDE TRANSISTOR A transistor device capable of high performance at high temperatures. The transistor comprises a gate having a contact layer that contacts the active region. The gate contact layer is made of a material that has a high Schottky barrier when used in conjunction with a pa... | 09/13/2012 |
| 20120223657 | Semiconductor Light Emitting Devices Having Selectable And/or Adjustable Color Points and Related Methods Semiconductor light emitting devices include a first string of at least one blue-shifted-yellow LED, a second string of at least one blue-shifted-green LED, and a third string of at least one LED that emits light in the red color range. These devices include at least a ... | 09/06/2012 |
| 20120223366 | HIGH VOLTAGE GAN TRANSISTOR A multiple field plate transistor includes an active region, with a source, drain, and gate. A first spacer layer is between the source and the gate and a second spacer layer between the drain and the gate. A first field plate on the first spacer layer and a second fiel... | 09/06/2012 |
| 20120217865 | SOLID STATE LIGHT EMITTING DEVICES INCLUDING NONHOMOGENEOUS LUMINOPHORIC PARTICLE SIZE LAYERS A light emitting device includes an LED and a layer of luminophoric particles, such as phosphor, that are non-homogeneous in size as a function of distance away from the LED. For example, a first layer of relatively large size phosphor particles may be provided between ... | 08/30/2012 |
| 20120206039 | PHOSPHOR DISTRIBUTION IN LED LAMPS USING CENTRIFUGAL FORCE A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured re... | 08/16/2012 |
| 20120201025 | LIGHTING APPARATUS PROVIDING INCREASED LUMINOUS FLUX WHILE MAINTAINING COLOR POINT AND CRI A lighting module includes a plurality of solid state light emitting components configured to collectively emit light having a desired white point and a color rendering index (CRI) of greater than about 90. The module further includes at least one additional solid state... | 08/09/2012 |
| 20120199843 | HIGH REFLECTIVE BOARD OR SUBSTRATE FOR LEDS Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which reduces the absorption of LED light. This increases the amount of light t... | 08/09/2012 |
| 20120197599 | METHODS, SYSTEMS, AND APPARATUS FOR DETERMINING OPTICAL PROPERTIES OF ELEMENTS OF LIGHTING COMPONENTS HAVING SIMILAR COLOR POINTS A method of determining lighting contributions of elements of a lighting component includes obtaining optical data representative of light output of the lighting component. Relative intensity data may be calculated from the optical data, and may indicate intensity diffe... | 08/02/2012 |
| 20120193662 | REFLECTIVE MOUNTING SUBSTRATES FOR FLIP-CHIP MOUNTED HORIZONTAL LEDS A light emitting device includes a mounting substrate having a reflective layer that defines spaced apart anode and cathode pads, and a gap between them. A light emitting diode die is flip-chip mounted on the mounting substrate, such that the anode contact of the LED di... | 08/02/2012 |
| 20120193661 | GAP ENGINEERING FOR FLIP-CHIP MOUNTED HORIZONTAL LEDS A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is pro... | 08/02/2012 |
| 20120193660 | HORIZONTAL LIGHT EMITTING DIODES INCLUDING PHOSPHOR PARTICLES Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 μm is provided on the oblique... | 08/02/2012 |