US Patent Application 20100068615 - RESIN COMPOSITION FOR METAL PLATING, MOLDED ARTICLE THEREOF, AND METAL-PLATED MOLDED ARTICLE
InventorsAssigneeUS Classes429/163, Cell enclosure structure, e.g., housing, casing, container, cover, etc.525/232, Solid polymer derived from reactant containing at least two ethylenic groups and is devoid of aryl ring525/233, Polymer derived from nitrogen-containing reactant428/462, Including polyene monomers (e.g., butadiene, etc.)427/443.1Chemical compound reducing agent utilized (i.e., electroless deposition)Attorney, Agent or FirmForeign Documents
International ClassesC08L 9/00C08L 9/02 B32B 15/06 H01M 2/02 B05D 1/18 Issued Patent Number:8017692Abstract textA resin composition for metal plating provides a molded article exhibiting excellent metal plating adhesion strength and chemical resistance, while having excellent productivity. A metal-plated molded article can also be made from such a resin composition. The resin composition for metal plating includes 50-90% by mass of Component (A) and 10-50% by mass of Component (B), the total of Component (A) and Component (B) being 100% by mass, wherein Component (A) is a polypropylene resin, and Component (B) is a rubber-reinforced vinyl resin obtained by polymerizing a vinyl monomer in the presence of a rubber-like polymer, or a mixture of the rubber-reinforced vinyl resin and a (co)polymer of the vinyl monomer. The composition may further include 0.5-30 parts by mass of a compatibilizer (C) per 100 parts by mass of the total of Component (A) and Component (B). Component (B) is preferably a non-diene rubber-reinforced resin. |
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