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US Patent Application 20100067168 - COMPOSITE ORGANIC ENCAPSULANTS

Application 20100067168 Filed on December 11, 2007. Published on March 18, 2010

Abstract text


This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

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