InventorsAssigneeUS Classes439/73, With external, contact enhancing clamp439/60, Contacts at different distances from lead panel circuit edge439/603Retaining contact within distinct coupling part housingAttorney, Agent or FirmForeign Documents
International ClassesH01R 12/00H01R 13/40 Issued Patent Number:7775821Abstract textA socket adapted for interconnecting an IC package (3), such as TSOP (Thin Small Outline Package), and a circuit board, includes a socket body (1), a plurality of contacts (2) received in the socket body, and an operating member (5) movable mounted on the socket body. Each contact includes a base portion (21) retained into the slot of the socket body and a first and a second contact beams (24, 25), each extending upwardly from an upper edge of the base portion. When a force is applied on the operating member, both of the first and the second contact beams cooperated with the operating member and moving away from its original position. |
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