US Patent Application 20100032410 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
InventorsUS Classes216/58, GAS PHASE ETCHING OF SUBSTRATE118/715, GAS OR VAPOR DEPOSITION118/400, IMMERSION OR WORK-CONFINED POOL TYPE156/345.11, For liquid etchant156/345.1, DIFFERENTIAL FLUID ETCHING APPARATUS427/248.1, COATING BY VAPOR, GAS, OR SMOKE216/83, NONGASEOUS PHASE ETCHING OF SUBSTRATE427/430.1, IMMERSION OR PARTIAL IMMERSION134/99.1Plural fluids applying conduitsAttorney, Agent or FirmForeign Documents
International ClassesB44C 1/22C23C 16/54 C23F 1/08 C23C 16/44 B05D 1/18 B08B 3/00 Abstract textA substrate processing apparatus includes a bath in which a liquid or a gas is fed, and a mechanism which feeds out a liquid or a gas into the bath. The substrate processing apparatus processes a to-be-processed substrate which is disposed in the bath. The mechanism includes a first feed-out device and a second feed-out device configured to feed out the liquid or gas into the bath, the first feed-in device configured to start/stop the feed-out of the liquid or gas from the first feed-out device, and second feed-in device configured to start/stop the feed-out of the liquid or gas from the second feed-out device. |
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