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US Patent Application 20100003832 - VAPOR PHASE DEPOSITION APPARATUS, METHOD FOR DEPOSITING THIN FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Application 20100003832 Filed on September 17, 2009. Published on January 7, 2010

Inventors

Assignee

US Classes

438/758, COATING OF SUBSTRATE CONTAINING SEMICONDUCTOR REGION OR OF SEMICONDUCTOR SUBSTRATE427/248.1, COATING BY VAPOR, GAS, OR SMOKE257/E21.211Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (EPO)

Attorney, Agent or Firm

Foreign Documents

  • 2004-164124 JP 06/02/2004

International Classes

H01L 21/30
C23C 16/52


Abstract text


A vapor phase deposition apparatus 100 for forming a thin film comprising a chamber 1060, a piping unit 120 for supplying a source material of the thin film into the chamber 1060 in a gaseous condition, a vaporizer 202 for vaporizing the source material in a source material container 112 and supplying the vaporized gas in the piping unit 120 and a temperature control unit 180, is presented. The temperature control unit 180 comprises: a first temperature control unit 174, which is composed of a heater controller unit 172 and a tape heater 170 and is capable of controlling the temperature of the first piping 116 in the piping unit 120 that is directly connected to the chamber 1060; a second temperature control unit 176, which is composed of a heater controller unit 168 and a tape heater 166 and is capable of controlling the temperature of the second piping 114 that is connected to the vaporizer; and a third temperature control unit 178, which is composed of a heater controller unit 167 and a thermostatic chamber 153 and is capable of controlling the temperature of the valve 159.

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