Abstract text

Chemical vapor deposition systems and methods of coating a substrate are provided. The method includes evacuating a processing chamber to a threshold pressure. The substrate and the processing chamber are heated to a first processing temperature. A first pellet having a vaporization temperature that is below the first processing temperature is dispensed into the processing chamber and exposed to the first processing temperature within the processing chamber to vaporize the first pellet into a first processing vapor to produce a pressure change from the threshold pressure to a first pressure to cause the first processing vapor to flow through the processing chamber and onto the substrate. The substrate is exposed to the first processing vapor for a predetermined time.