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US Patent Application 20090287338 - SYSTEMS AND METHODS FOR SELECTING WAFER PROCESSING ORDER FOR CYCLICAL TWO PATTERN DEFECT DETECTION

Application 20090287338 Filed on May 15, 2008. Published on November 19, 2009

Inventor

US Classes

700/110, Defect analysis or recognition700/108Performance monitoring

Attorney, Agent or Firm

International Class

G06F 17/00

Issued Patent Number:

7987014


Abstract text


A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.

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