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US Patent Application 20090284930 - MODULAR HEATSINK MOUNTING SYSTEM

Application 20090284930 Filed on May 14, 2009. Published on November 19, 2009

Inventor

Assignee

US Class

361/715For module

Attorney, Agent or Firm

International Class

H05K 7/20

Issued Patent Number:

7859849


Abstract text


In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.

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