Abstract text

To predict occurrence of an earthquake so as to minimize damage by preventing an object to be processed from flying out of an opened container. A semiconductor manufacturing apparatus 1 includes: a transfer area Sa including a transfer mechanism 13 for a container 3; a detection mechanism 32 configured to detach a lid 3a from the container 3 on a loading and unloading part 7 and to detect a position of an object to be processed w; a receiving and sending mechanism 33 configured to receive the container 3 from the transfer mechanism 13 and to send the container 3 to the transfer mechanism 13; an elevating mechanism 18 disposed in a working area Sb below a heating furnace 5, the elevating mechanism 18 being configured to support a holder 4 holding a plurality of objects to be processed on a lid member 17 and to load and unload the holder 4 into and out of the heating furnace 5; a door mechanism 15 configured to open and close an opening 34 of a partition wall 6 separating the transfer area Sa and the working area Sb together with a lid 3a of the container 3, and an aligning mechanism 16 of an object to be processed. An emergency earthquake notice, which is delivered based on a preliminary tremor through a communication line, is received by a reception part 28, or a preliminary tremor is directly detected by a preliminary-tremor detection part 60. A control part 29 carries out a first step in which an operation of a semiconductor manufacturing apparatus 1 is stopped based on the emergency earthquake notice received by the reception part 28 or the preliminary tremor detected by the preliminary-tremor detection part 60, and a second step in which, when the door mechanism is being opened, the door mechanism 15 is closed.