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US Patent Application 20090088008 - METHOD FOR HORIZONTAL INSTALLATION OF LGA SOCKETED CHIPS

Application 20090088008 Filed on October 2, 2007. Published on April 2, 2009

Inventors

Assignee

US Classes

439/73, With external, contact enhancing clamp439/342, Including compound movement of coupling part439/65With provision to conduct electricity from panel circuit to another panel circuit

Attorney, Agent or Firm

International Classes

H01R 12/16
H01R 13/62

Issued Patent Number:

7507102


Abstract text


Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.

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