InventorsUS Classes439/331, Movement-actuating or retaining means comprises cover press439/342, Including compound movement of coupling part439/486, Tube clamp439/729, Spring-operated or resilient securing part439/73With external, contact enhancing clampAttorney, Agent or FirmInternational Class H01R 13/635 Issued Patent Number:7766691
Abstract textTechniques for a land grid array (LGA) socket loaded mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and a LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed. | 
