Claims

1-46. (canceled)

47: A burn-in socket for testing an integrated circuit manufactured by the method of:fabricating contact elements in a sacrificial substrate, the sacrificial substrate including cavities to form tips of the contact elements;fabricating an interconnect structure by attaching the contact elements to a wiring substrate supporting electrical routing lines, by connecting the electrical routing lines to the contact elements opposite the tips, and by then removing the sacrificial substrate; andfabricating a socket board configured to hold a semiconductor chip diced from a wafer for test purposes, wherein fabricating the socket board includes attaching said interconnect structure to the socket board.

48: A method comprising the steps of:providing resilient spring contact elements on a substrate;fabricating a socket configured to hold a device under test;providing the substrate in the socket so that when the device under test is placed in the socket, electrical connectors of the device under test can contact the resilient spring contact elements; andperforming burn in testing of the device under test with the device under test supported in the socket.

49: The method of claim 47, wherein the step of providing resilient spring contact elements includes forming tips for the contact elements in cavities within a sacrificial substrate.

50: The method of claim 49 further comprising the step of etching the sacrificial substrate to form the cavities.

51: The method of claim 49 further comprising the step of forming the sacrificial substrate from copper.

52: The method of claim 49 further comprising the step of forming the sacrificial substrate from aluminum.

53: The method of claim 49 further comprising the step of forming the sacrificial substrate from silicon.

54: The method of claim 49 further comprising the step of forming the sacrificial substrate from ceramic.

55: The method of claim 49, further comprising the step of forming the sacrificial substrate from titanium-tungsten.

56: The method of claim 48, wherein the step of providing resilient spring contact elements comprises the steps of:depositing masking material on the substrate;forming openings in the masking material corresponding to the elements;depositing a first conductive material in the openings;bonding a wire to said conductive material in each of the openings;depositing a second conductive material over the wires;removing the masking material.

57: The method of claim 56, further comprising the step of using rhodium material as the first conductive material.

58: The method of claim 48, further comprising the step of providing vias in the substrate for electrically connecting the resilient spring contact elements to a board in the socket.