InventorsAssigneeUS Classes216/2, ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION216/39, FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED216/56ETCHING TO PRODUCE POROUS OR PERFORATED ARTICLEAttorney, Agent or FirmInternational ClassesC25F 7/00A61K 9/22 Abstract textMethods are provide for fabricating a microchip device having containment reservoirs. In one embodiment, the method includes providing a substrate; forming a plurality of reservoirs in the substrate, each reservoir having an opening in a surface of the substrate; fabricating a plurality of metal reservoir caps, each of which closes off one of said openings; and sealing each of said reservoirs. The method may further include loading chemical molecules, such a drug, into each of said reservoirs before said sealing of the reservoirs. |
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