U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

US Patent Application 20080032521 - IC SOCKET AND IC PACKAGE MOUNTING DEVICE

Application 20080032521 Filed on July 20, 2007. Published on February 7, 2008

Inventors

Assignee

US Class

439/73With external, contact enhancing clamp

Attorney, Agent or Firm

Foreign Documents

  • 2006-199538 JP 07/21/2006

International Class

H01R 12/00

Issued Patent Number:

7635268


Abstract text


An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

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