U.S. patents available from 1976 to present.
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US Patent Application 20070281509 - Tool for semiconductor package

Application 20070281509 Filed on June 5, 2007. Published on December 6, 2007

Inventor

Assignee

US Class

439/73With external, contact enhancing clamp

Attorney, Agent or Firm

Foreign Documents

  • 95209738 TW 06/05/2006

International Class

H01R 12/00

Issued Patent Number:

7591065


Abstract text


A tool for aligning a semiconductor package with an electrical connector, comprises a body, a plurality of latching members assembled to the body and a back plane. The body defines a center through hole which has a funnelform casing at bottom end thereof for aligning and guiding the semiconductor package. The latching member has a latching portion for retaining the tool to the electrical connector.

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