U.S. patents available from 1976 to present.
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US Patent Application 20070275574 - Chip Assembly Structure With Cover

Application 20070275574 Filed on August 8, 2007. Published on November 29, 2007

Inventor

Assignee

US Class

439/73With external, contact enhancing clamp

Attorney, Agent or Firm

International Class

H01R 12/02


Abstract text


The present invention provides a chip assembly structure with a cover, comprising: a socket having four sidewalls to form a room for placing a chip and comprising a plurality of contact ends corresponding to the contacts of the chip to be placed, wherein each contact ends penetrates said socket to form an exposing solder terminal; and a cover having at least a flexible part against on the chip when the chip is positioned in the room.

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